138results about How to "Reduce alignment accuracy requirements" patented technology

A three dimensional device stack structure comprises two or more active device and interconnect layers further connected together using through substrate vias. Methods of forming the three dimensional device stack structure comprise alignment, bonding by lamination, thinning and post thinning processing. The via features enable the retention of alignment through the lamination process and any subsequent process steps thus achieving a mechanically more robust stack structure compared to the prior art.

The display panel of this invention includes a pair of glass substrates each with a thickness not less than 0.15 mm and not more than 0.3 mm and a sealing material for bonding the pair of glass substrates to each other. A resin layer is formed on the outer face of at least one of the pair of glass substrates.

An image display unit having a back-side substrate on which a number of electron emission elements are arranged, and a front-side substrate which is opposed to a back-side substrate and has fluorescent patterns and light-shielding patterns arranged at positions corresponding to electron emission elements, wherein a marking area is provided at least two locations in an ineffective part of the inside of the front-side substrate, corresponding to alignment marks of a dry plate, and each marking area has three alignment marks. According to the present invention, it is unnecessary to change R, G, B masks whenever three color fluorescent patterns are exposed, and realignment between a mask and a substrate is unnecessary.

The invention discloses a doping structure for improving efficiency and bandwidth of a silicon-based electro-optic tuning device. The doping structure comprises a P+ type doping area arranged on the outer ridge area on one side close to the edge and is in ohmic contact with the above metal; A P type doping area is arranged on the outer ridge area connected with the P+ type doping area and extends to the inner ridge area; An N+ type doping area is arranged on the outer ridge area on the other side close to the edge and is in ohimic contact with the above metal; A N-type doping area is arranged on the outer ridge area connected with the N+ type doping area and extends to the inner ridge area and is complementary with the P type doping area; An almost-I type doping area is arranged between the P type doping area and the N type doping area and forms an almost PIN knot with the P type doping area and the N type doping area. By means of the doping structure, the silicon-based electro-optic tuning device is improved in the aspects of the modulator speed, efficiency and insertion loss, the cost is reduced, the requirement of the ion implantation process for the mask alignment accuracy is reduced, and large-scale manufacture of the device is facilitated.

The embodiment of the invention provides a liquid crystal display panel and a manufacturing method thereof, relating to the display field. The problem of low-temperature bubbles of the display panel can be effectively solved; and the anti-pressure capability of the display panel can be ensured, so that the quality of a display picture can be ensured. The liquid crystal display panel comprises an upper substrate, a lower substrate, a liquid crystal layer and a spacer, wherein the liquid crystal layer and the spacer are arranged between the upper substrate and the lower substrate; and the liquid crystal display panel is characterized in that the spacer is arranged in an area corresponding to a grid line in the liquid crystal display panel. The liquid crystal display panel provided by the embodiment of the invention is applied to manufacturing of liquid crystal displays.

An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

Provided are a chip cutting method and a chip packaging method. The chip packaging method includes the steps that at least two chip structures are provided, wherein each chip structure comprises a chip and an insulating layer at least located on the side wall of the chip, the side wall of the insulating layer of each chip structure is provided with a conductive groove, the chip structures are stacked, and the conductive grooves of the different chip structures correspond to each other in position; the insides of the conductive grooves are filled with conductive adhesives, wherein circuits in the different chip structures are electrically connected through the conductive adhesives. Due to the fact that the conductive grooves are formed in the side walls of the insulating layers, the conductive adhesives formed in the conductive grooves cannot be in direct contact with the chips, and short-circuit phenomena cannot occur; due to the fact that the conductive grooves and contact welding plates are connected through metal interconnection layers on the surfaces of the insulating layers, the insulating layers cannot influence layout design of other metal interconnection structures in the chips, the chip area occupied by the metal interconnection structures can be saved, and the component integration degree of the chips can be beneficially improved.

The invention provides an intelligent fixture switching system, which includes a storage location and a turntable, wherein the storage location includes a Z-direction lifting device, an X-direction transfer platform, and a Y-direction storage location; the turntable includes a plurality of switching platforms and Turntable drive; the motor drive part of the warehouse is controlled by the robot system, the warehouse is docked with a certain switching platform, and the other switching platforms continue to work. Compared with the prior art, the present invention is a system based on robot control for conveying, storing and switching fixtures to cooperate with industrial robots for grasping, welding and spraying. Not only is the mechanical structure flexible, but also intelligent flexible production can be realized in combination with intelligent control. It meets the requirements of versatility, automation, and intelligent switching of fixtures, and greatly improves production efficiency and effectively reduces production costs.

The invention discloses a display substrate, a display device and a production method of the display substrate. According to the display substrate, the display device and the production method, the product yield of the display substrate and the resolution ratio of the display device are increased. The display substrate comprises a substrate and a plurality of pixel units arrayed on the substrate,wherein the pixel units include a light-emitting diode, a connecting metal and a thin film transistor which are sequentially arranged along the direction far from the substrate; the connecting metal is electrically connected with a top electrode of the light-emitting diode; and an active layer of the thin film transistor is isolated from the connecting metal, and a drain electrode of the thin filmtransistor is conductively connected with the connecting metal.

The invention provides a laser and silicon optical chip integrated structure and a preparation method thereof. The laser and silicon optical chip integrated structure comprises a laser chip which comprises a first waveguide, and a silicon optical chip which comprises a second waveguide, wherein the second waveguide and the first waveguide couple the light emitted by the laser chip into the siliconoptical chip in an evanescent wave coupling manner. According to the laser and silicon optical chip integrated structure prepared by the invention, the first waveguide in the laser and the second waveguide in the silicon optical chip couple the light emitted by the laser into the silicon optical chip in the evanescent wave coupling manner, compared with the end face coupling in the prior art, thecoupling mode has lower requirement for alignment accuracy in the flip-chip bonding process, and still has higher coupling efficiency even under the actual process condition that alignment has errors.

Provided are a chip structure and a chip packaging structure. The chip packaging structure comprises at least two chip structures and conductive adhesives located in conductive grooves, wherein the side walls of the chip structures are provided with the conductive grooves, the chip structures are stacked, the conductive grooves of the stacked chip structures correspond in position, and circuits in the stacked chip structures are electrically connected through the conductive adhesives. Due to the fact that the conductive grooves are formed in the side walls of insulating layers, the conductive adhesives formed in the conductive grooves later cannot be in direct contact with chips, and short-circuit phenomena cannot occur; due to the fact that the conductive grooves and contact welding plates are connected through metal interconnection layers on the surfaces of the insulating layers, the insulating layers cannot influence layout design of other metal interconnection structures in the chips, the practice that extra metal interconnection structures are designed due to positions of the contact welding plates is needless, the chip area occupied by the metal interconnection structures can be saved, and the component integration degree of the chips can be beneficially improved.

A method for manufacturing a contact lens having a multilayer structure using a mold, includes: (a) charging a first polymerizing composition into a space formed by combining a first mold with a second mold, and polymerizing a first semi product having a thinner thickness and a smaller outer diameter than those of a contact lens immediately before being removed from the molds after all polymerizing processes; (b) opening the first and second molds; and (c) charging a second polymerizing composition into a space formed by combining a third mold with one of the first and second mold, the first semi product fixed onto the one of the first and second molds, and polymerizing the second polymerizing composition.

The invention provides a making method of a large-caliber film diffraction element with high diffraction efficiency to solve technical problems existing in a present preparing process of large-caliber film diffraction elements. The method includes the first step of making of a multi-step relief structure quartz substrate, the second step of polymer solution coating, the third step of polymer solution curing and film forming, the fourth step of film and substrate separating, and the fifth step of film splicing. The method has the advantages of being low in cost, high in repeatability, simple and efficient. The diffraction efficiency of the element made with the method is not lower than 7%.

The invention relates to the field of micro-nano machining, and in particular relates to a preparation method of a flexible substrate-based folding spiral inductor provided with a magnetic core; the folding spiral inductor is obtained by combining a preparation method of a plane inductor with folding; compared with the inductor which is not folded, the folding spiral inductor has obviously improved performances; and compared with a three-dimensional inductor prepared by the traditional technology, the folding spiral inductor has the advantages of being simple in processing steps and low in cost. The folding spiral inductor prepared by the method has the characteristics of being good in performances, small in volume, flexible (bended and folded), good in biological compatibility, simple in preparation method and the like, can be widely applied to various biological and non-biological microsystems, and is especially used for an implantable wireless energy transmission system.

An embodiment of the invention discloses an array substrate of a thin film transistor (TFT)-liquid crystal display (LCD) and a manufacture method thereof, which relate to the technical field of liquid crystal displays and can reduce storage capacity when aligning accuracy is not high. The array substrate comprises a substrate, grid lines and data lines, wherein the grid lines and the data lines are arranged on the substrate. Each grid line and each data line intersect to define a pixel unit which comprises the TFT, a pubic electrode, a first pixel electrode layer and a second pixel electrode layer, wherein the first pixel electrode layer and the second pixel electrode layer are separated by an insulation layer. The first pixel electrode layer is connected with the pubic electrode and comprises a plurality of first pixel electrodes separated by first pixel electrode layer openings. The second pixel electrode layer is connected with a drain electrode of the TFT and comprises a plurality of second pixel electrodes separated by second pixel electrode layer openings. The second pixel electrode comprises overlaying-position pixel electrodes completely overlaid on the first pixel electrodes and opening-position pixel electrodes with edges completely in the first pixel electrode layer openings.

A liquid crystal display device having thin film transistors which can alleviate the required alignment accuracy of a semiconductor film while suppressing the generation of an optical leak current is provided. The liquid crystal display device includes: a transparent substrate; gate electrodes which are stacked above the transparent substrate; source electrodes and drain electrodes which are stacked above the gate electrodes; and semiconductor films each of which is stacked above the gate electrode and controls an electric current between the source electrode and the drain electrode based on an electric field generated by the gate electrode, wherein the semiconductor film is formed into a planar shape, and includes a first region which overlaps with the gate electrode in plane and a second region which does not overlap with the gate electrode in plane, and the source electrode and the drain electrode are not connected to the semiconductor film in the second region, and are connected to the semiconductor film in the first region.

A prism of an ink tank has a function for reflecting light, which is incident from the outside, to the outside when no liquid is present in a liquid chamber and not reflecting the light, which is incident from the outside, to the outside when a liquid is present in the liquid chamber, and when the optical characteristics of a material constituting the liquid accommodation container are measured based on a standard according to JIS K7105, the material has optical characteristics equivalent to such optical characteristics that a transmittance of all light beams is 80% or more and a Haze value is equal to or more than 75% and equal to or less than 85%. With the above arrangement, there can be provided an ink tank, which can be operated stably and detect a remaining amount of ink, at a low price.

The present invention provides an apparatus and a method for detecting a piping alignment using image information and laser sensors capable of precisely and accurately measuring and aligning the alignment of the entire pipes. The apparatus includes: a fixed plate installed on a base stage and having a reference pipe located thereon; a movable plate installed on the base stage along three axes to face the reference pipe and has an aligning pipe located thereon; a circular stage installed between the reference and aligning pipes and is configured to rotate and move along three axes so as to detect levelness and deformations of the reference and aligning pipes; a laser sensor and an imaging device installed on an upper side of the circular stage; and a controller configured to control the laser sensor and the imaging device and determine an alignment of the aligning pipe.

The invention discloses a device and method for wireless light scattering communication on the basis of Mie scattering. Original light scattering is achieved through rayleigh scattering based on light and gas molecules in the air, and communication distance is short generally. Light scattering communication is achieved through Mie scattering based on light and aerosol particles in the air, common waveband photoelectric devices can be selected as components required by a system, and remote non-line-of-sight light scattering communication can be achieved by using strong forward light scattering characteristics of the Mie scattering. A corresponding device comprises a light sending device and a light receiving device, the light sending end of the system sends light signals, and the light signals are detected and scattered at the receiving end through scattering of the aerosol particles in the air to achieve communication. The device and method for the wireless light scattering communication on the basis of the Mie scattering reduces requirements on accuracy of an optical antenna in a wireless optical communication system, can establish non-line-of-sight communication link between two long-distance points rapidly, and achieves light scattering communication.

The invention discloses a thermal compounding manufacturing process of a battery cell. The thermal compounding manufacturing process comprises the following process steps that: a pole piece is manufactured, namely, single pole pieces are formed after a pole piece belt with a belt-shaped structure is subjected to pole lug forming and pole piece cutting; pole piece bags are manufactured, namely, a single-sheet-shaped first pole piece or a single-sheet-shaped second pole piece is bonded to the front side wall and the back side wall through diaphragms on the two sides in a thermal compounding mode respectively, diaphragms on the front side and the back side extend to the outer side of the first pole piece or the outer side of the second pole piece and then are bonded to form a continuous pole piece bag, and the continuous pole piece bag is cut into single pole piece bags; and a battery cell is formed, namely, the single pole pieces and the single pole piece bags are mutually staggered and overlapped to form a battery cell. According to the invention, the problem of wrinkling of the diaphragms is solved, the position precision between the positive and negative pole pieces is ensured, the single diaphragm alignment process of the traditional lamination is simplified by adopting diaphragms larger than the pole pieces, the lamination efficiency is effectively improved, combustion caused by short circuit is reduced, and the safety coefficient of the battery is improved.

The invention provides an FPC and FPC double-sided adhesive tape integrated cutting method; the integrated cutting method comprises the following steps that: S1, a release paper on one side of an FPCdouble-sided adhesive tape is replaced with an anti-static blue PET film by a laminating machine, wherein one surface of the replaced FPC double-sided adhesive tape is the release paper, while the other surface is the anti-static blue PET film; S2, and an LED lamp is fixedly connected to the whole board of the FPC by an SMT technology; S3, one side, with the release paper, of the FPC double-sidedadhesive tape is removed, and then the side is attached to the back surface of the whole board of the FPC to enable the FPC double-sided adhesive tape to be combined with the whole board of the FPC; and S4, a product obtained in the step S3 is placed on a lower die table of an outer shape punching die, and the product obtained in the step S3 is cut by a punching cutter of the outer shape punchingdie, so as to obtain a plurality of independent FPCAs. By adoption of the method, the whole board of the FPC and the whole FPC double-sided adhesive tape are attached together firstly, and the cut FPCs do not need to be connected with each other via a connection point, so that the problems of edge tearing, burrs, salient points and the like of the FPCA can be effectively reduced.