Heat radiating shell

A heat-dissipating, housing technology, applied in cooling/ventilation/heating renovation, electrical equipment housing/cabinet/drawer, electrical components, etc. problems to ensure stable operation

Inactive Publication Date: 2009-09-09
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the metal shield shell can achieve the purpose of shielding electromagnetic wave interference, it does not propose how to solve the above-mentioned situation of excessive temperature of the electronic device shell, and does not propose any suggestions on how to dissip

Method used

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  • Heat radiating shell
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Examples

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Example Embodiment

[0052] The following describes the implementation of the present invention through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0053] Furthermore, the following drawings are simplified schematic diagrams, which only illustrate the basic concept of the present invention in a schematic manner. The drawings only show elements related to the present invention rather than drawn according to the number, shape and size of the elements in actual implementation. In its actual implementation, the type, number, and ratio of the components can be changed at will, and the component layout type may also be more complicated.

[0054] See figure 2 , figure 2 It is a schematic diagram of the application of an embodiment of the heat-dissipating housing of the present invention. As shown in the figure, the present invention provides a heat-dissipating housing ...

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Abstract

The invention relates to a heat radiating shell, which is applied to a circuit board provided with a heating element. The heat radiating shell comprises a metal cover and a shell wrapping the metal cover, wherein the metal cover is provided with an accommodation space for accommodating the circuit board, a gap is kept between the shell and the metal cover to form an air interlayer so as to reduce the temperature of the shell and overcome the defects of the prior art.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to a heat dissipation housing applied to a circuit board with heating elements. Background technique [0002] Common electronic equipment such as audio-visual, video, monitoring equipment, switches, servers, computers, etc., are equipped with various components and / or modules on the circuit board inside the casing, and include many heating elements that generate heat during operation. In order to maintain an appropriate temperature so that the electronic equipment can operate stably, it is extremely important whether the heat energy in the casing can be effectively dissipated, because in the case of poor heat dissipation, as the operating temperature of the electronic equipment increases, it will inevitably lead to The phenomenon of unstable operation will cause problems such as crashes, thereby reducing the service life of electronic equipment. [0003] At the same time, most of th...

Claims

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Application Information

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IPC IPC(8): H05K5/00H05K7/20H05K9/00
Inventor 刘文杰郭广亮郑再魁
Owner INVENTEC CORP
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