Radiating component and radiating method
A technology of heat dissipation components and heat dissipation methods, which can be used in electrical components, electric solid state devices, semiconductor devices, etc., and can solve problems such as high prices
Inactive Publication Date: 2011-01-05
RAYDIUM SEMICON
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Problems solved by technology
Active cooling devices, such as air-cooled cooling fans or circulating cooling systems with coolant and micro-channels, compared with passive cooling devices, active cooling devices have a better cooling effect, but the price More expensive than passive forms of cooling
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Abstract
The invention discloses a radiating component, which comprises a fluid cavity, a micro channel, a first electrode and at least one second electrode. The fluid cavity is used for accommodating fluid. The micro channel branches and extends from the fluid cavity to attach to the radiating component. The first electrode is arranged in the fluid cavity and is contacted with the fluid. The second electrodes are arranged on the side wall of the micro channel, and the polarities of the electrodes are opposite to the polarity of the first electrode, wherein the first electrode and the second electrodes are electrified, the first electrode can provide electric charges to the fluid, and the fluid enter the micro channel from the fluid cavity to reach the preset position according to the voltage loaddegree of the second electrodes so as to approach the radiating component.
Description
Heat dissipation component and heat dissipation method technical field The present invention relates to a heat dissipation assembly, a heat dissipation system and a heat dissipation method, and in particular, the present invention relates to a heat dissipation assembly, a heat dissipation system and a heat dissipation method for regulating the position of a cooling liquid by utilizing the electro-wetting effect. Background technique In recent years, due to the rapid development of semiconductor technology, the functions of chips have undergone more and more changes, and their sizes have become smaller and smaller. For a single chip, the more functions that change, the more signal transmission pins are required. On the other hand, the smaller the size, the denser the chip and the signal transmission pins. In this multi-quantity and high-density design, the heat generated by the chip is much higher than before, and the heat generated is less likely to escape because of the d...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/473
Inventor 周忠诚王威李大元
Owner RAYDIUM SEMICON
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