The invention discloses a thermoelectrically separated type PCB member and a
processing method thereof. The PCB member comprises a
metal substrate; depth-controlling
etching is carried out on the middle part of the
metal substrate to form a boss bonding pad and a PP layer is arranged around the
metal substrate; and a circuit layer is arranged on the PP layer and is formed by
etching of a
metal foil layer laminated on the PP layer and the boss bonding pad. In addition, the preparation method includes: S1, a
metal substrate is made to form an inner pattern and
etching is carried out on the substrate to form a
salient point bonding pad; S2, a PP layer and a
metal foil are excavated; S3, the
metal substrate with the
salient point bonding pad etched, the PP layer, and the
metal foil are laminated to form a half-finished laminated multi-layer board product; S4, mechanical
grinding is carried out to
grind the
salient point bonding pad to
expose the salient point bonding pad; and S5, the circuit is etched. The method aims at realizing
processing of a thermoelectrically separated type PCB member. According to the thermoelectrically separated type PCB member, components are connected with the
copper substrate directly to realize a direct
cooling effect, so that the heat dissipation effect is improved substantially, the light output rate of the LED is enhanced, and the high stability of the lighting effect is guaranteed.