Thermoelectrically separated type PCB member and processing method thereof
A PCB board and thermoelectric separation technology, which is applied in the direction of electrical components, circuit substrate materials, circuit thermal components, etc., can solve problems such as inability to meet heat dissipation requirements, avoid accidental damage, ensure stability, and increase light output rate Effect
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[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work, any modifications, equivalent substitutions, improvements, etc., shall be included in the protection scope of the present invention Inside.
[0020] Such as figure 1 As shown, the thermoelectrically separated PCB board of the present invention is a laminated multilayer board and includes a metal substrate 1 for heat dissipation. The center of the metal substrate 1 is controlled to deep-etch the boss pad 11, and The metal substrate 1 is laminated with a PP layer 2 around the bump pad 11, the PP layer 2...
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