Thermoelectrically separated type PCB member and processing method thereof

Abstract

The invention discloses a thermoelectrically separated type PCB member and a processing method thereof. The PCB member comprises a metal substrate; depth-controlling etching is carried out on the middle part of the metal substrate to form a boss bonding pad and a PP layer is arranged around the metal substrate; and a circuit layer is arranged on the PP layer and is formed by etching of a metal foil layer laminated on the PP layer and the boss bonding pad. In addition, the preparation method includes: S1, a metal substrate is made to form an inner pattern and etching is carried out on the substrate to form a salient point bonding pad; S2, a PP layer and a metal foil are excavated; S3, the metal substrate with the salient point bonding pad etched, the PP layer, and the metal foil are laminated to form a half-finished laminated multi-layer board product; S4, mechanical grinding is carried out to grind the salient point bonding pad to expose the salient point bonding pad; and S5, the circuit is etched. The method aims at realizing processing of a thermoelectrically separated type PCB member. According to the thermoelectrically separated type PCB member, components are connected with the copper substrate directly to realize a direct cooling effect, so that the heat dissipation effect is improved substantially, the light output rate of the LED is enhanced, and the high stability of the lighting effect is guaranteed.

Description

technical field [0001] The invention relates to the technical field of PCB board products, in particular to a thermoelectrically separated PCB board and a processing method thereof. Background technique [0002] LED is a solid-state semiconductor light-emitting device, it has no pollution, and it is the third generation of lighting sources in the world today. At present, the electro-optical conversion efficiency is close to 28%, which is the highest among known existing luminescent materials. However, the traditional LED heat dissipation method is to generate heat from the components, and then dissipate the heat to the metal base through the heat conduction medium, the copper base (aluminum base) for heat dissipation, and the medium with high thermal conductivity between the circuit and the metal base to dissipate heat. The general heat dissipation coefficient is 1.5-4w / m.k. With the widespread use of LEDs, high-power LEDs using traditional heat dissipation media + metal-...

AI Technical Summary

Problems solved by technology

With the widespread use of LEDs, high-power LEDs using traditional heat dissipation media + metal-based structures cannot meet their heat dissipation needs at all.

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