Cooling device, battery and electronic equipment

A technology of heat dissipation device and electronic equipment, which is applied to secondary batteries, circuits, electrical components, etc., can solve the problems of affecting heat dissipation effect and high system operating temperature, and achieve the effect of improving heat dissipation effect, reducing system operating temperature, and avoiding equipment overheating.

Active Publication Date: 2016-11-09
LENOVO (BEIJING) LTD
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  • Abstract
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Problems solved by technology

[0004] However, the above-mentioned way of conducting heat to the shell of the device through the heat-conducting material for heat dissipation will be restricted by the heat-conducting performance of the shell material, and many users put a protective cover on the shell of the mobile phone when using the mobile phone, which will affect the heat dissipation effect and make the device The system operating temperature within the higher

Method used

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  • Cooling device, battery and electronic equipment
  • Cooling device, battery and electronic equipment

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] like figure 1 and figure 2 As shown, the embodiment of the present invention provides a heat dissipation device, comprising: an endothermic material 1, the specific heat capacity of the endothermic material 1 is greater than that of the heat conducting material; Inside the cavity, the material of the side wall 2 of the packaging cavity is a heat-conducting material, and the side wall 2 of the packaging cavity is used to connect the heating device 3 to tran...

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Abstract

The invention provides a cooling device, a battery and electronic equipment, and relates to the technical field of electronic products. The operating temperature of a system in the equipment can be reduced and the cooling effect is improved. The cooling device comprises a heat-absorbing material and a packaging cavity, wherein the specific heat capacity of the heat-absorbing material is greater than that of a heat-conducting material; the packaging cavity is enclosed by side walls; the heat-absorbing material is arranged in the packaging cavity; the material of each side wall of the packaging cavity is the heat-conducting material; the side walls of the packaging cavity are used for being connected with a heating device; and heat emitted from the heating device is transmitted to the heat-absorbing material. The cooling device is mainly used for cooling in the equipment.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a heat dissipation device, a battery and electronic equipment. Background technique [0002] The heat dissipation problem of electronic equipment has become one of the important factors restricting its development. Excessively high system operating temperature will lead to unstable operation of electronic equipment, so solving the system heat dissipation problem in electronic equipment has become a key point. [0003] Taking mobile terminal equipment such as smart phones and tablet computers as examples, more and more mobile terminal equipment adopt fast charging design. Among them, components such as charging interface, control circuit, battery connector and protection board circuit in mobile terminal equipment Serious heat will be generated in the charging mode. The traditional solution to the problem of heating of mobile terminal equipment generally uses heat-condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01M10/613H01M10/653
CPCH01M10/613H01M10/653H05K7/2039Y02E60/10
Inventor 马超朱昊
Owner LENOVO (BEIJING) LTD
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