Package assembly for upper/lower electrode light-emitting diodes and light-emitting device manufacturing method using same

Abstract

A package assembly for upper / lower electrode light-emitting diodes useful for manufacturing a light-emitting device whose light source is an upper / lower electrode light-emitting diode and which satisfies requirements such as the capacity of the current flowed for light emission, the dissipativity of the heat produced by a large current, the resistance to thermal stress, the strength of the device, and the luminous efficiency. A method for manufacturing a light-emitting device whose light source is an upper / lower light-emitting diode by using this package assembly is also provided. A package for upper / lower electrode light-emitting diodes is composed of a metal sheet on which a large number of upper / lower electrode light-emitting diodes package units are fabricated. Each package unit includes two or more substrates which are divided by a slit and are parts of the metal sheet and a reflector having a through opening, covering a part of the slit, and joined to the two or more substrates in such a way that the position to which an upper / lower electrode light-emitting diode is attached is exposed inside the through opening and the ends of the slit are exposed outside the reflector.

Description

technical field [0001] The present invention relates to a package body for an upper and lower electrode type light emitting diode having an upper electrode and a lower electrode. In particular, the present invention relates to a packaging assembly before manufacturing a light-emitting device with a lower-electrode type light-emitting diode as a light source, and a packaging assembly for an upper-lower electrode-type light-emitting diode suitable for mass production of such a light-emitting device. The present invention also relates to a method of manufacturing a light-emitting device using the package assembly of the present invention and using a light-emitting diode of the upper and lower electrodes as a light source. Background technique [0002] 25A and 25B are schematic diagrams and plan views illustrating a conventional light emitting device using a light emitting diode as a light source, that is, a light emitting diode assembly. In FIGS. 25A and 25B, the light emittin...

AI Technical Summary

Problems solved by technology

[0015] (1) The thickness of the line material used is limited, and it is impossible to flow a large current or flow a large current to scorch the surrounding materials,

[0016] (2) The connection strength of the line material is uneven, and the line material is prone to peeling off,

[0018] (4) Due to the ultrasonic vibration and pressure at the time of connection, the electrode or semiconductor layer of the light-emitting diode is prone to cracks, so it is necessary to fine-tune the device used

LEDs are often adversely affected when this temperature is not managed adequately

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