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Method for cleaning a substrate

A substrate, cleaning technology, applied in the direction of chemical instruments and methods, detergent compositions, electrical components, etc., can solve the problems of non-disclosure and the like

Active Publication Date: 2012-01-11
艾斯宜株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, although the prior art has disclosed a method for cleaning a substrate using deionized water and a liquid having a surface tension lower than that of water, it does not disclose cleaning the substrate at room temperature by adjusting deionized water and isopropanol The mixing ratio to simplify the drying process

Method used

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  • Method for cleaning a substrate

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Embodiment Construction

[0036] In the following, several preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0037] figure 1 is a cross-sectional view of an embodiment of an apparatus for cleaning a single substrate by applying the method for cleaning a substrate according to the present invention.

[0038] Such as figure 1 As shown, the device 10 for cleaning a substrate used in the method for cleaning a substrate according to the present invention includes: a substrate fixing device 100 (also referred to as a "chuck") to fix and rotate a substrate 102 at an upper part; Devices 104, 106, to distribute the cleaning solution or deionized water used for rinsing to the surface of the rotating substrate; the online static mixer (108), connected to the distributor 106, is used to mix and distribute to the surface of the substrate 102 Liquid (such as deionized water and isopropanol) to make azeotropic mixture; flow meter 110, 114,...

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Abstract

The present invention discloses the method for cleaning a substrate by dispensing to substrate an azeotropic mixture which is easily evaporated at the room temporature after producing the azeptropic mixture by controling the mixture ratio of a deionized water (DIW) and a liquid whose surface tenstion is lower than the surface tension of water. The method includes rotating the substrate, dispensing a cleaning liquid to the surface of the rotating substrate, producing an azeotropic mixture by mixing a deionized water with a liquid whose surface tension is lower than the surface tension of water, dispensing the azeotropic mixture to the surface of the rotating substrate and finishing drying by providing the substrate with an inert gas.

Description

technical field [0001] The present invention relates to a method of cleaning substrates or wafers in the process of producing semiconductors, and more particularly, to a method of producing an azeotropic mixture and using it to clean substrates. Background technique [0002] The performance, reliability and yield of integrated circuits are affected by the wafers used in the production process, or by unwanted physical / chemical impurities remaining on the surface of the components after production is complete. [0003] As the minimum linewidth of components decreases to the submicron range, techniques to clean substrate surfaces cleanly prior to oxidation and patterning become more desirable. Techniques for cleaning the surface of semiconductor wafers are generally classified into wet chemical cleaning methods, dry cleaning methods, vapor methods, etc., and wet cleaning methods are commonly used methods. Among various wet cleaning methods, the RCA cleaning method including st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304
CPCH01L21/02052C11D7/5031
Inventor 金大熙
Owner 艾斯宜株式会社