Semiconductor device manufacturing method

Abstract

The invention provides a semiconductor device manufacturing method, which is object to improve the reliability and manufacture yield of the semiconductor apparatus. A semiconductor element has a first electrode and a second electrode separated by an insulation layer, a bonding material is configured on the metal foil, and the semiconductor element is placed on the bonding material in a mode of contacting it with a third electrode. In addition, the sheet-shape second conductive bonding material is opposite to the first electrode and the second electrode of the semiconductor element, and the lower end of the post electrode is opposite to the upper surfaces of the first electrode and the second electrode with bonding material intervening therebetween. And the welding material is separated byan insulation layer, the first electrode is connected to the post electrode through bonding material. Furthermore, the third electrode is jointed to the metal foil through bonding material. Therefore, the reliability and manufacture yield of the semiconductor apparatus can be improved.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a method of manufacturing a semiconductor device on which a plurality of power semiconductor elements are mounted. Background technique [0002] In an inverter device, an uninterruptible power supply device, a machine tool, an industrial robot, etc., a semiconductor device mounted with a plurality of power semiconductor elements is used independently of its main device. Furthermore, recently, a semiconductor device of a wireless structure that does not use bonding wires has attracted attention in order to pass more large currents (for example, refer to Patent Document 1). [0003] Figure 21 It is a figure of main part of the semiconductor device of a wireless structure. [0004] The illustrated semiconductor device 100 has a metal base plate 101, an insulating plate 102 bonded to the metal base plate 101, and conductive patterns 103a, 103b, 103...

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Problems solved by technology

In addition, since the solder material is pasty, there is a problem that flux components or solder material scatter during reflow.

[0011] In addition, with the recent miniaturization of semiconductor elements, the weight of the semiconductor element 105 itself has become lighter. If a paste-like solder material is applied by printing, the semiconductor element 105 will move, and the application position of the paste-like solder will occur. problems such as deviation

[0012] Furthermore, there are variations in the heights of the post electrodes 112a, and in post electrodes with a relatively short distance, there is a problem that the lower part of the post electrodes and the electrodes cannot be sufficiently bonded through the solder layer.

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