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Heat-conducting medium protecting cover and heating abstractor with the protecting cover

A heat-conducting medium and heat-dissipating device technology are applied in the field of a heat-conducting medium protective cover and a heat-dissipating device having the protective cover, which can solve the problems of bending and deformation, affecting the heat-dissipating effect of the radiator of electronic components, etc., and achieve the effect of protecting the heat-conducting medium.

Inactive Publication Date: 2009-10-21
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the protective cover is usually made of plastic, it is very easy to bend and deform. The concave structure of the above protective cover is often bent and deformed due to external force, so that it contacts with the heat-conducting medium and scratches the heat-conducting medium, affecting the installation in the future. Heat dissipation effect of heat sink on electronic components

Method used

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  • Heat-conducting medium protecting cover and heating abstractor with the protecting cover
  • Heat-conducting medium protecting cover and heating abstractor with the protecting cover
  • Heat-conducting medium protecting cover and heating abstractor with the protecting cover

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Embodiment Construction

[0011] see figure 1 , figure 1 Shown is the heat transfer medium protection cover 30 of the present invention and a heat sink 10 on which the heat transfer medium protection cover 30 can be installed.

[0012] The radiator 10 includes a base 11, one side of the base 11 is provided with a contact surface 113 for contacting with an element to be dissipated, the middle part of the contact surface 113 is coated with a heat conduction medium layer 15, and the four corners of the contact surface 113 are not coated with heat conduction. Medium, the radiator 10 is equipped with a number of heat dissipation fins 14 and two heat pipes 13 on the other side of the base 11, one end of the two heat pipes 13 is installed in these heat dissipation fins 14, and the other end is fixed on the base 11 and these heat dissipation fins Between slices 14.

[0013] The heat conduction medium protection cover 30 includes a cover plate 31 for covering the heat conduction medium layer 15 , the shape an...

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Abstract

The invention relates to a heat-conducting medium protecting cover which is used for covering a heat abstractor so as to protect the heat-conducting medium smeared on the heating abstractor; the heat-conducting medium protecting cover comprises a cover plate used for covering the heating-conducting medium; the cover plate is provided with a plurality of reinforcing ribs in a convex way; the reinforcing ribs are against the heating abstractor to lead that the cover plate does not contact the heat-conducting medium. The invention also comprises the heating abstractor provided with the heat-conducting medium protecting cover. The protecting cover and the heating abstractor can be applied in the assembly of various electronic devices needing heat dissipation.

Description

technical field [0001] The present invention is related to heat dissipation, in particular to a heat-conducting medium protection cover and a heat dissipation device with the protection cover. Background technique [0002] With the continuous development of the electronic industry, the operating frequency and speed of electronic components (especially the central processing unit) continue to increase, and the heat generated by electronic components also increases, and the temperature continues to rise, which seriously affects the normal operation of electronic components. In order to ensure For the normal operation of electronic components, a radiator is usually installed on the surface of the electronic component to remove the heat generated by the electronic component in time, but if the radiator is directly installed on the surface of the electronic component, there is a gap between the radiator and the surface of the electronic component , the air in the gap increases th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427G06F1/20
CPCH01L23/427H01L23/367H01L23/3672H01L2924/3011H01L23/4006F28F2265/02H01L2924/0002H01L2924/00
Inventor 徐礼福王宁宇张治国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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