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Disc holding apparatus and defect/foreign material detecting apparatus

A technology for holding devices and circular plates, which is applied in the manufacturing of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of longer time, reduced production volume, and considerable time consumption, and achieves the goal of shortening time and increasing production volume. Effect

Active Publication Date: 2009-10-21
가부시키가이샤옵티마
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this method, the time for the step to detect the notch becomes longer and the throughput decreases
[0008] (3) Since a plurality of slide arms are located on the bottom side of the wafer, in the case of obtaining surface information of each surface by photographing both sides of the wafer with a camera, one side (surface) is photographed with a camera, and then the wafer is The front and back are reversed, and the camera is used to shoot the other side, so it will take a lot of time to shoot both sides of a wafer

Method used

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  • Disc holding apparatus and defect/foreign material detecting apparatus
  • Disc holding apparatus and defect/foreign material detecting apparatus
  • Disc holding apparatus and defect/foreign material detecting apparatus

Examples

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no. 1 approach

[0129] according to Figure 1 to Figure 12 The disk holding device and the defect and foreign matter detection device provided with the disk holding device according to the first embodiment will be described.

[0130]The disc holding device, such as figure 1 and figure 2 As shown, a plurality of gripping movable claws 3 are provided, and the inner end sides of the plurality of gripping movable claws 3 respectively have a gripping portion 3a abutting against the outer side of the disc-shaped wafer 1 having a notch 1A. 1 are arranged at equal intervals in the circumferential direction. In this example, there are six movable claws 3 for holding (refer to Figure 4 ). In addition, disc holding devices such as Figure 1 ~ Figure 3 as well as Figure 6 As shown, a movable claw is provided as a movable claw driving mechanism for moving a plurality of grasping movable claws 3 in a radial direction passing through the center of the wafer 1 (radial direction of the wafer 1) betwe...

no. 2 approach

[0183] Second, according to Figure 13 A disk holding device and a defect and foreign object detection device including the disk holding device according to a second embodiment of the present invention will be described.

[0184] The disc holding device and the defect and foreign object detection device equipped with the disc holding device according to the second embodiment are characterized in that each gripping portion 3a of the plurality of gripping movable claws 3 abuts on the outer peripheral portion of the wafer 1, respectively. The upper part 1c and the lower part 1d of the V-shaped tapered surface 3c.

[0185] Since the V-shaped tapered surface 3c of each gripping portion 3a abuts against the upper portion 1c and the lower portion 1d of the outer peripheral portion of the disc to grip the disc, the disc can be reliably gripped.

[0186] According to the second embodiment of this structure, not only reach the action effect that above-mentioned first embodiment reaches...

no. 3 approach

[0188] Second, according to Figure 14 (A) and 14(B) Figures illustrate a disk holding device and a defect and foreign object detection device equipped with a disk holding device according to a third embodiment of the present invention.

[0189] The disc holding device and the defect and foreign matter detection device provided with the disc holding device according to the third embodiment are as follows: Figure 9 The first embodiment shown in (A) and 9(B) is characterized in that a grip releasing member 22A is provided instead of the grip releasing portion 22 .

[0190] The grip release portion 22A includes an engagement member 31 and an air cylinder 32 for advancing and retreating the engagement member 31 . The grip release part 22 is to use the air cylinder 32 to make the engaging member 31 move from Figure 14 (A) The withdrawal position shown in the figure is shifted to Figure 14 In the engagement position shown in (B), the engagement surface 31 a of the engagement m...

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Abstract

A disc holding apparatus is provided with a plurality of movable holding claws (3), which have a holding section (3a) abutting to the outer circumference of a wafer (1) having a notch (1A) and are arranged in the circumference direction of the wafer (1). Since the wafer (1) is held by having each holding section (3a) on the inner edge side of each movable holding claw (3) abut to the outer circumference of the wafer (1), at the time of detecting the notch by a sensor composed of a light source and a light receiving section, even when one of the holding sections (3a) abuts to the outer circumference of the wafer (1) at a part where the notchexists, light from the light source is permitted to enter the light receiving section through the notch without being blocked by the holding section (3a). Even when the wafer (1) is held at the part where the notch exists, the wafer (1) is not required to be correctly held again and throughput is improved with a shortened process time.

Description

technical field [0001] The present invention relates to a disc holding device for holding and positioning a disc such as a silicon wafer, and a defect and foreign matter detection device for detecting defects and adhesion of foreign matter on the front, back and outer peripheral parts of the disc. Background technique [0002] Conventionally, there is known a wafer holding device that adjusts the center position and direction of a wafer loaded by a wafer transfer robot (for example, Japanese Reference Patent Document 1). The conventional holding device described in this document includes a plurality of slide arms (grip mechanisms) that are driven to open and close toward the center of the wafer, and is formed so that the outer periphery of the wafer is held by claws at the outer ends of the slide arms. [0003] Patent Document 1: (Japanese) Unexamined Patent Publication No. 2006-222190 [0004] A silicon wafer (hereinafter referred to as "wafer") has a direction (crystal or...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/683
CPCH01L21/68728H01L21/681H01L21/68H01L21/683
Inventor 宗像光良
Owner 가부시키가이샤옵티마
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