Indentation operation electronic device and push switch

Abstract

The invention relates to an indentation operation electronic device and a push switch. The project of the invention is to make soft soldering with simple flux management and capable of corresponding with thickness of a metal mask, as well as realizing a thin type and miniaturization of the product. The indentation operation electronic device of the invention is provided, on one end side, with an outer fixed terminal (7a) revealed toward a hinder side face (2c) of a shell (2), and is provided, on the other end side, with an earthing contact component (7) of a leading out terminal (7b) extracted toward side faces (2b) on the left and the right from underneath (2a) side of the shell (2); the earthing contact component (7) is arranged on the shell (2) together with converted contact components (5, 6) through insertion molding; besides, a cover (10) formed by metal material and the outer fixed terminal (7a) of the earthing contact component (7) are pushed against and installed on the shell (2); the leading out terminal (7b) of the earthing contact component (7) is connected with and installed on an earthing circuit of a printed circuit board.

Description

technical field [0001] The present invention relates to a press-in operation type electronic device and a push switch, in particular to a press-in operation type electronic device and a push switch suitable for surface mounting on printed circuit boards of various electronic devices. Background technique [0002] Conventionally, various components are known for push-in operation type electronic devices such as push switches mounted on printed circuit boards of electronic equipment by surface mounting (for example, refer to Patent Document 1: Japanese Unexamined Patent Application Publication No. 9-120742). [0003] In addition, for the push switch, which is a push-in operation type electronic device mounted on the printed circuit board of the electronic device, it is necessary to prevent the static electricity charged on the operator's body from flowing into the circuit of the electronic device from the hand or finger through the operation part of the push switch. Countermea...

AI Technical Summary

Problems solved by technology

[0017] However, like the above-mentioned push switch, the ground terminal piece 112 hanging down from the rear end of the upper panel 108a on the cover 108 along the rear side surface 102b of the housing 102 is provided, and the ground terminal piece 112 is soldered to the printed circuit board. In the structure where static electricity countermeasures are carried out on the wiring portion of the ground circuit of the board 115, when the ground terminal piece 112 is soldered, the gap S1 between the housing 102 and the ground terminal piece 112 (refer to Figure 14 ) due to capillary phenomenon may flow into the flux, and there is a problem that it is difficult to manage the flux during soldering

[0018] As a measure to prevent the inflow of this flux, a structure that ensures a large gap S1 between the case 102 and the ground terminal piece 112 and eliminates capillarity is required, but there is a problem that the outer dimensions become larger by enlarging the gap S1

Moreover, since the front end (lower end) of the ground terminal piece 112 is bent outward at a right angle, it becomes larger by a dimension corresponding to the protrusion amount S2 from the cover 108, and there is a problem in miniaturization.

[0019] In addition, since the ground terminal piece 112 is provided on the cover 108, the soldering surface of the ground terminal piece 112 becomes the packing size of the housing 102 and the cover 108, and is inserted into the lead-out terminal 105A, which is provided on the housing 102 side, 105B has a problem that errors easily occur between soldering surfaces, and it is not suitable for thin soldering of metal masks.

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