Method of manufacture procedures for manufacturing metal protrusion and fusion welded metal

Abstract

A method of manufacture procedures for improving coplanarity of fusion welded metal on the surface of a metal protrusion structure is applicable to flip chip protrusion fusion welded technology of a semi-conductor chip. When metal protrusions with different sizes are arranged on the surface of a component, height unevenness after high-temperature processing of the fusion welded metal due to different sizes of the protrusions can be eliminated or reduced, and therefore difficulty of downstream testing and packaging is reduced. In order to achieve the purposes, the invention provides a method using two manufacture procedures. Metal protrusion area and fusion welded metal area are controlled respectively, and the coplanarity of the fusion welded metal is improved. The steps include: a first manufacture procedure and a second manufacture procedure. The first manufacture procedure is used for manufacturing the metal protrusion structure on the surface of a semi-conductor component, and the second manufacture procedure is used for manufacturing a fusion welded metal structure with different area on the surface of the metal protrusion.

Description

technical field [0001] The invention relates to a process method for improving the metal coplanarity of metal bump surface welding, especially a process method suitable for the flip-chip bump welding technology of semiconductor wafers, and when the surface of the element has metal bumps of different sizes , can eliminate or reduce the problem of non-uniform height of welded metal after high-temperature treatment caused by different bump sizes, thereby improving the difficulty of downstream testing and packaging. Background technique [0002] In recent years, with the rapid development of semiconductor technology, the packaging technology of semiconductor wafers is also increasingly advanced. In terms of gallium arsenide chip packaging, such as power amplifier modules or radio frequency components, wire bond packaging technology is traditionally the main technology, that is, gold wires are used to interactively connect the metal contacts of each component in the chip by spot ...

AI Technical Summary

Problems solved by technology

However, if Figure 2A to Figure 2C As shown, when the size of the copper bump is different, after high temperature treatment, the welded metal on the surface of the bump will form islands of different heights due to surface tension, which will cause difficulties in the subsequent welding process with the circuit board, thus reducing the packaging yield.

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