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Led devices and associated methods

A technology of light-emitting diodes and laser diodes, applied in electrical components, electrical solid-state devices, circuits, etc.

Inactive Publication Date: 2009-11-04
宋健民
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, there is no electronic device cooling method and related devices that can properly cool small-sized and high-power-consuming electronic devices.

Method used

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  • Led devices and associated methods
  • Led devices and associated methods
  • Led devices and associated methods

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Embodiment Construction

[0024] definition

[0025] In describing and defining the present invention, the following terminology will be used in accordance with the following definitions.

[0026] Singular articles such as "a" and "the" include multiple meanings, unless the context clearly indicates a different usage. Thus, for example, reference to "a heat source" includes one or more such heat sources, and reference to "the diamond layer" includes one or more layered structures.

[0027] The terms "heat transfer," "heat movement," and "heat transport" are used interchangeably to refer to the rate at which heat is transferred from an area of ​​higher temperature to an area of ​​lower temperature. The heat transfer rate may include any heat transfer mechanism known to those skilled in the art, such as, without limitation, conduction, convection, radiation, and the like.

[0028] As used herein, the term "thermally conductive material" refers to any thermally conductive material known to those skilled...

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PUM

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Abstract

Methods for cooling semiconductor devices having a light-emitting surface and associated devices are disclosed and described. Such a device (10) may include a light-emitting surface (16) and a diamond layer (14) disposed on at least a portion of the light-emitting surface (16). The diamond layer (14) may be exposed to air in order to accelerate movement of heat away from the light-emitting surface (16) and into the air.

Description

technical field [0001] The present invention relates to methods of cooling semiconductors and other electronic devices and related devices. Accordingly, the present invention relates to the fields of electronics and materials science. Background technique [0002] In many developed countries, most people regard electronic devices as an integral part of their lives. People's use and dependence on electronic devices is gradually increasing, resulting in the demand for computing speed and lightness of electronic devices. As electronic circuits increase computing speed and reduce size, cooling measures for these devices have become a problem. [0003] An electronic device usually includes a plurality of circuit boards on which electronic components are integrated to perform various functions of the device. These electronic components, such as processors, transistors, resistors, capacitors, LEDs, etc., generate considerable heat. When the heat builds up, it can cause various ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/10H01L23/34
CPCH01L33/641
Inventor 宋健民
Owner 宋健民