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Surface acoustic wave device and method for manufacturing the same

A technology of surface acoustic waves and manufacturing methods, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric devices/electrostrictive devices, material selection for piezoelectric devices or electrostrictive devices, etc., It can solve the problems of deterioration of the electrical characteristics of the surface acoustic wave device 50, the inability to obtain tightness, and the inability to hermetically seal the storage space, achieving excellent long-term reliability

Active Publication Date: 2012-05-30
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, the frame of the protective cover is not sufficiently hardened at the part where the connecting wire is in contact, and sufficient adhesion cannot be obtained between the connecting wire and the protective cover, so the storage space cannot be hermetically sealed.
For this reason, the electrical characteristics of the surface acoustic wave device 50 may be degraded if moisture, corrosive gas, chemical solution, etc. are immersed in the storage space during the manufacturing process or after the device is completed.

Method used

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  • Surface acoustic wave device and method for manufacturing the same
  • Surface acoustic wave device and method for manufacturing the same
  • Surface acoustic wave device and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0019]

[0020] figure 1 It is a schematic schematic diagram showing the surface acoustic wave device S1 according to the first embodiment of the present invention. figure 1 The A-A section of (b) roughly corresponds to figure 1 (a) The section shown. However, the specific dimensions and arrangement intervals of each part are not limited to figure 1 shown. in addition, figure 1 (b) is a diagram useful for understanding the arrangement relationship, and it is not necessarily the case when the surface acoustic wave device S1 is viewed from above. figure 1 Identify as shown in (b).

[0021] Such as figure 1 As shown, the surface acoustic wave device S1 of this embodiment mainly includes a piezoelectric substrate 1 , an IDT 2 , a connection wire 3 , a protective cover 6 , and a bonding film 8 .

[0022] The piezoelectric substrate 1 is, for example, a piezoelectric single crystal substrate such as lithium tantalate single crystal or lithium niobate single crystal.

[002...

no. 2 approach

[0054]

[0055] image 3 It is a schematic cross-sectional view schematically showing a surface acoustic wave device S2 according to a second embodiment of the present invention. Among the components included in the surface acoustic wave device S2 of the present embodiment, the same reference numerals are assigned to the components having the same function and effect as those of the surface acoustic wave device S1 of the first embodiment, and description thereof will be omitted.

[0056]In the surface acoustic wave device S2 of the present embodiment, the connecting wire 3 extends to the outside of the protective cover 6 while the housing space 7 is ensured by the protective cover 6 . In other words, it is formed so that a part of the protective cover 6 straddles over the connection line 3 . However, the surface acoustic wave device S2 is different from the surface acoustic wave device S1 of the first embodiment in that the housing 4 and the cover 5 of the protective cover ...

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Abstract

A surface acoustic wave device excellent in reliability and a method for manufacturing the same. The surface acoustic wave device comprises a piezoelectric substrate (1) for making a surface acoustic wave travel thereon, an IDT (2) formed on a first major surface of the piezoelectric substrate (1), and a protective cover (6) composed of a photocurable material and covering the region for forming the IDT(2), thereby forming a hollow containing space (7) together with the first major surface wherein an acid generating portion containing an acid generating material is provided in a region at thelower end of the protective cover. The surface acoustic wave device further comprises a connection line (3) formed on the first major surface and connected with the IDT(2) while being led out from theinside to the outside of the protective cover (6) to have an end on the outside of the protective cover (6), and a bonding film (8) composed of an insulating material and formed to be interposed at least between the acid generating portion of the protective cover (6) and the connection line (3).

Description

technical field [0001] The present invention relates to a surface acoustic wave device mainly used in wireless communication circuits such as mobile communication equipment and a method of manufacturing the same. Background technique [0002] In recent years, portable terminal devices used for mobile communication have been increasing in size and weight, and built-in circuits are increasing due to multi-band and multi-functionalization to cope with a plurality of communication systems. For this reason, the possibility of surface mounting or miniaturization for increasing the mounting density is strongly desired for the electronic components used. [0003] As a key component of a portable terminal device, there is a surface acoustic wave device. A surface acoustic wave device generally has a configuration in which a sealed hollow portion is ensured as a vibration space in the vicinity of an electrode surface that excites a surface acoustic wave. Such surface acoustic wave d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/25H01L41/09H01L41/18H01L41/22H03H3/08H03H9/145H01L41/23
CPCH03H9/059H03H9/1092H01L2224/11Y10T29/42
Inventor 深野彻福浦笃臣
Owner KYOCERA CORP