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Electronic device and radiating unit thereof

A technology of electronic devices and heat dissipation units, which is applied in the direction of electrical components, circuits, and electric solid devices, can solve problems such as circuit complexity and energy consumption, and achieve the effects of shortening the overall length, reducing thermal resistance, and improving heat dissipation efficiency

Active Publication Date: 2011-07-13
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the known technology, the length of the wire 24 and the wire 34 is relatively long, which causes the complexity of the circuit and consumes energy

Method used

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  • Electronic device and radiating unit thereof
  • Electronic device and radiating unit thereof
  • Electronic device and radiating unit thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] refer to Figure 2A , which shows the heat dissipation unit 100 of the embodiment of the present invention, including a heat sink 130 , a first fixing base 110 , a first heat pipe 111 , a second fixing base 120 and a second heat pipe 121 . The first fixing seat 110 is located on a first plane. The first heat pipe 111 is connected to the first fixing base 110 and the heat sink 130 . The second fixing seat 120 is located on a second plane. The second heat pipe 121 connects the second fixing base 120 and the heat sink 130 , wherein the first fixing base 110 partially overlaps the second fixing base 120 . Both the first fixing seat 110 and the second fixing seat 120 are fixed elastic pieces. The first heat pipe 111 and the second heat pipe 121 are substantially L-shaped.

[0015] A first circuit element 112 is fixed on the first fixing seat 110 , and a second circuit element 122 is fixed on the second fixing seat 120 . The first circuit element 112 and the second circu...

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PUM

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Abstract

The invention discloses a radiating unit which comprises a radiator, a first fixed base, a first heat pipe, a second fixed base and a second heat pipe, wherein the first fixed base is positioned on a first plane; the first heat pipe is connected with the first fixed base and the radiator; the second fixed base is positioned on a second plane, and a spacing is kept between the first plane and the second plane; the second heat pipe is connected with the second fixed base and the radiator, wherein the first fixed base on a projection plane is partially overlapped with the second fixed base, and the projection plane is parallel to a circuit board.

Description

technical field [0001] The invention relates to a heat dissipation unit, in particular to a heat dissipation module applied to a notebook computer. Background technique [0002] refer to Figure 1A , which shows a known cooling unit 1 applied to a notebook computer. The heat dissipation unit 1 includes a radiator 10 , a fixing base 20 , a fixing base 30 , a heat pipe 21 and a heat pipe 31 . A graphics card 22 is fixed on the fixing base 20 , and a graphics card 32 is fixed on the fixing base 30 . The heat pipe 21 is connected to the fixing base 20 to bring the heat of the graphics card 22 to the radiator 10 . The heat pipe 31 is connected to the fixing base 30 to bring the heat of the graphics card 32 to the radiator 10 . In the known technology, since the graphics card 22 and the graphics card 32 are arranged side by side, the width of the notebook computer cannot be reduced. In addition, since the graphics card 32 is far away from the heat sink 10 , the length of the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/427H01L23/40G06F1/20
CPCH01L2924/0002
Inventor 何铭远
Owner ASUSTEK COMPUTER INC