Socket for electronic part installation

Abstract

A socket for mounting on a substrate includes a terminal exposure part that exposes the plurality of substrate connection terminals of the contacts at lower opposing edges of the socket, and a central part that includes a bottom surface bulging part that protrudes downwardly to define a bottom surface of the socket housing. An insulative contact support board that houses the contacts is housed inside a thickness of the bulging part. A bottom surface of a substrate connection terminal of the contacts supported by the contact support board is exposed at the terminal exposure part. A bottom surface bulging part is inserted into a housing bottom mating hole formed in the connection substrate, and the substrate connection terminal is connected to a pattern terminal provided on the upper surface of an edge of the housing bottom mating hole.

Description

technical field [0001] The present invention relates to a socket for mounting an electronic device mainly for mounting a camera module on a substrate. Background technique [0002] Conventionally, when mounting a camera module on a printed circuit board arranged in electronic equipment such as a mobile phone, the heat-resistant camera module cannot be directly mounted by soldering, so a socket for mounting an electronic device is used to connect the printed circuit board. circuit wiring on the substrate. [0003] This main electronic device mounting socket includes: a socket housing having an electronic device accommodating portion with an upper opening formed by a bottom plate portion and a peripheral wall formed by standing walls standing up from the periphery of the bottom plate portion; and a support For a plurality of contacts in the socket housing, the elastic contact pieces integrally provided with the contacts protrude from the inner surface of the electronic device...

AI Technical Summary

Problems solved by technology

[0010] In each of the above-mentioned conventional examples, as in Patent Document 3, in terms of the method of inserting the connection substrate into the lower side of the case for mounting, although the connection terminal portion of the substrate exposed on the bottom surface of the case is soldered to the surface of the substrate Compared with the way on the graphic terminal part of the socket, the installation height of the socket relative to the substrate becomes lower, but since the substrate connection terminal part is exposed under the flange-shaped protruding part of the main body of the housing, there is a presence on the surface of the substrate. Disadvantages of wider occupied area

[0011] On the contrary, as in Patent Documents 1 and 2, soldering the substrate connection terminal portion exposed on the bottom surface of the case to the pattern terminal portion on the surface of the substrate is similar to the method of inserting the connection substrate into the lower side of the case for mounting. Compared with the method, the occupied area on the substrate surface is small, but there is a disadvantage of high mounting height relative to the substrate

[0012] In addition, in the method of accommodating the contact to the housing, as shown in Patent Document 1, the method of accommodating the holding part of the contact and the bent part folded back into a U-shape within the thickness of the peripheral wall and the method of accommodating it within the thickness of the bottom plate In comparison, although the height becomes lower and the installation height relative to the substrate surface becomes lower, there are disadvantages that the lateral width becomes larger and the occupied area of ​​the substrate surface becomes larger.

On the contrary, as in Patent Document 2, compared with the method of housing in the thickness of the peripheral wall, the method of housing in the thickness of the base plate has a smaller lateral width and a smaller area occupied by the substrate surface, but there is a problem that the installation height with respect to the substrate surface becomes higher. shortcoming

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