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Power amplification device and signal receiving and transmitting system

A signal transmission and power amplifier technology, applied in transmission systems, circuit devices, power amplifiers, etc., can solve the problems of expensive high-frequency plates and increased equipment manufacturing costs.

Active Publication Date: 2009-11-25
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because high-frequency plates are relatively expensive, the use of high-frequency plates will increase the manufacturing cost of the entire equipment

Method used

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  • Power amplification device and signal receiving and transmitting system
  • Power amplification device and signal receiving and transmitting system
  • Power amplification device and signal receiving and transmitting system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Please refer to figure 2 , figure 2 Shown is a schematic structural diagram of the signal transceiving system 1000 of the present invention. Wherein, the signal output system 1000 includes a power amplifier device 100 , a filter element 170 electrically connected to the power amplifier device 100 , and an antenna element 180 electrically connected to the filter element 170 .

[0015] Please refer to image 3 , image 3 Shown is a schematic diagram of a power amplifier device 100 provided by an embodiment of the present invention. The power amplifier device 100 includes a structural component 110 , a circuit board 120 and a power amplifier 130 . Wherein, the structural member 110 is made of conductive material and grounded. The circuit board 120 can be a single-layer board or a multi-layer board. The power amplifier 130 is electrically connected to the circuit on the circuit board 120 .

[0016] The structural member 110 is provided with a first surface 112 , an...

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PUM

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Abstract

The embodiment of the invention discloses a power amplification device and a signal transmitting system applying the same. The power amplification device comprises a circuit board, a power amplifier and a structure component, wherein the circuit board is fixed on the structure component. The power amplifier is fixed on the circuit board or the structure component. The structure component is provided with a reference layer which is grounded. The power amplifier is provided with a pair of pins. A pair of containing parts is arranged between the circuit board and the structure component. The circuit board is respectively provided with overhead matching areas opposite to the containing parts. The matching areas are respectively provided with a power amplification matching part relative to the reference layer. The pins are electrically connected with the power amplification matching parts respectively. Because the containing parts among the power amplification matching parts and the reference layer can be filled with various materials as an intermediate medium of impedance matching according to requirements, the circuit board of the power amplification device of the embodiment of the invention has larger flexibility in the aspect of selecting materials.

Description

technical field [0001] The invention relates to communication technology, in particular to a power amplifier device and a signal transceiving system. Background technique [0002] Nowadays, in today's mobile communication signal transceiver systems, such as wireless base stations, in order to improve the efficiency of signal transmission, power amplifiers have become an indispensable component. The structure and design of power amplifiers have already formed a unified standard in the industry. When developing and manufacturing communication equipment, communication equipment manufacturers will directly purchase power amplifiers produced by third-party manufacturers to reduce R&D and manufacturing costs. Therefore, the factors that determine the performance of the power amplifier focus on the design of the circuit board and structural parts used to carry the power amplifier. [0003] figure 1 Shown is a schematic structural diagram of a communication device in the prior art...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B7/005H04B1/40H03F3/20
CPCH05K1/021H05K1/024H05K2201/09745H05K1/182H05K1/0243H05K2201/09781H05K1/0272H05K1/113H05K1/025H05K3/0061H05K2201/10166H01L2924/181H01L2224/48247H01L2224/48091H01L2924/00012H01L2924/00014
Inventor 郭江奕何平华
Owner HUAWEI TECH CO LTD
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