Double-axis positioning method

Abstract

The invention relates to a double-axis positioning method. The method comprises the following steps: (a) firstly, utilizing an air-bearing platform to bear a basal plate with two marks, and then utilizing two clamps moving along the air-bearing platform on an X axis to clamp the basal plate so that the basal plate is arranged in a positioning position; (b) utilizing two visual devices to respectively compare the marks when the basal plate is arranged in the positioning position so as to recognize a bias angle of the basal plate in the Y axis direction; and (c) moving one clamp along the X axis direction until the bias angle is equal to zero when the bias angle is not equal to zero so as to correct the position of the basal plate.

Description

technical field [0001] The present invention relates to a laser cutting machine, in particular to a biaxial positioning method for a laser cutting machine. Background technique [0002] Known positioning method for laser cutting machine, its steps are as follows: a) Utilize an air bearing platform to first carry a substrate, and then define a datum plane by a corrector, and the edge of the substrate is positioned by abutting against the datum plane The purpose of; b) using at least two clamps to clamp the substrate and remove the aligner, the clamps drive the substrate to move synchronously along an X-axis direction to transport the substrate; thus, the prior art achieved through the above steps The purpose of positioning the substrate. [0003] However, the corrector must be applicable under the premise that the substrate is cut correctly; when the edge of the substrate is skewed due to improper cutting, the corrector cannot correct the substrate and cause the substrate to...

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Problems solved by technology

[0003] However, the corrector must be applicable under the premise that the substrate is cut correctly; when the edge of the substrate is skewed due to improper cutting, the corrector cannot correct the substrate and cause the substrate to shift; in other words, The aligner does not ensure that the substrate is positioned correctly

Furthermore, when transferring substrates of different sizes, the air-floating platform must replace the corresponding corrector; when the corrector deviates, it will cause the substrate to deviate, so the corrector needs to be calibrated frequently , to ensure the functionality of the corrector, has the problem of poor positioning

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