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Led package and structure for mounting three-dimensional circuit component

A technology for LED packages and three-dimensional circuits, applied in circuits, printed circuits, printed circuits, etc., can solve the problems of Manhattan phenomenon, solder damage, electrode floating, etc.

Inactive Publication Date: 2009-12-30
MATSUSHITA ELECTRIC WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the LED package is mounted on the mounting substrate via solder, if the amount of solder is different between the electrodes, there is a problem that one electrode floats due to the difference in surface tension when the solder melts or the shrinkage stress when the solder solidifies. The Manhattan Phenomenon
When stress is concentrated at the connection portion of the LED package and the wiring pattern on the mounting substrate due to thermal history, this phenomenon leads to a problem that the solder is broken during a thermal cycle test, etc., and conduction failure is caused
[0008] However, in the case of using the plate-shaped substrate described in Patent Document 1, when the plate-shaped substrate is mounted on the socket, if the contact spring is brought into contact with the side surface of the plate-shaped substrate, the width of the socket will increase. The socket becomes thicker when the surface part or the bottom surface part contacts
[0009] In this way, in the prior art, it is difficult to realize the miniaturization of the mounting structure of the three-dimensional circuit components.

Method used

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  • Led package and structure for mounting three-dimensional circuit component
  • Led package and structure for mounting three-dimensional circuit component
  • Led package and structure for mounting three-dimensional circuit component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0064] figure 2 as well as image 3 Is a perspective view showing the external structure of the package body 10 on which the LED chip is mounted, Figure 4 It is a cross-sectional view showing a state where the LED package in which the LED chip 11 is mounted on the package main body 10 is mounted on the mounting substrate 20.

[0065] The package body 10 has a body portion 12 made of, for example, a ceramic sintered body. As ceramic materials, alumina, aluminum nitride, silicon nitride, and the like are known. As the manufacturing method of the ceramic sintered body, injection molding, extrusion molding (press molding), cast molding, etc. are known, and any method may be adopted when manufacturing the package body 10. The main body portion 12 is configured such that a truncated cone-shaped recess is formed in the center portion, and the LED chip 11 is mounted on the bottom surface.

[0066] The bottom surface of the truncated cone-shaped recess is used as the LED chip mounting p...

no. 2 approach

[0089] Figure 13 as well as Figure 14 It is a perspective view showing the external structure of the package body 10 on which the LED chip 11 is mounted.

[0090] Figure 13 as well as Figure 14 The illustrated package body 10 is characterized in that a circuit pattern 14A connecting the positive terminal of the LED chip 11 and a circuit pattern 14B connecting the negative terminal of the LED chip 11 are arranged close to each other. Figure 13 The illustrated package main body 10 shows a state in which the circuit patterns 14A and 14B are arranged on two adjacent side surfaces among the four side surfaces of the three-dimensional main body portion 12. Figure 14 The illustrated package body 10 shows a state in which circuit patterns 14A and 14B are arranged on individual side surfaces among the four side surfaces of the three-dimensional body portion 12.

[0091] In this way, even if there are a plurality of circuit patterns connected to the LED chip 11, the plurality of cir...

no. 3 approach

[0105] Figure 17 It is a perspective view of the mounting structure of the three-dimensional circuit component of this embodiment. Figure 18 It is an exploded perspective view of the mounting structure of the three-dimensional circuit component, Figure 19 It is a top view of the mounting structure of the three-dimensional circuit component, Picture 20 Yes Figure 19 A-A section view, Figure 21 of Figure 19 B-B section view. In addition, the following uses LED chips as electronic components to exemplify the structure in which the three-dimensional circuit components are mounted on the heat sink.

[0106] The mounting structure of the three-dimensional circuit component of the present embodiment includes: a substantially rectangular parallelepiped-shaped LED chip 80 with positive and negative electrodes (not shown) formed on the lower surface; a three-dimensional circuit component 50 on which the LED chip 80 is mounted; and a three-dimensional circuit component 50 that houses...

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PUM

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Abstract

The invention provides a LED package and a structure for mounting three-dimensional circuit component. The LED package is provided with a three-dimensional substrate (12), which has an LED chip (11) mounted thereon and is mounted on a mounting board (20) electrically connected with the LED chip (11); and a plurality of elastic bodies (17) mounted on the mounting board (20) through a solder (21). The elastic bodies (17) maintains a position of the three-dimensional substrate (12) on the mounting board (20) by an elastic force applied from a plurality of outer surfaces facing each other, i.e., outer surfaces of the three-dimensional substrate (12), to inner surfaces.

Description

Technical field [0001] The present invention relates to an LED package in which a light emitting diode (Light Emitting Diode, hereinafter referred to as LED) chip is mounted on a package body and a mounting structure of a three-dimensional circuit component. Background technique [0002] At present, an LED package has been proposed in which an LED chip is mounted on a predetermined package body and the package body is mounted on a mounting substrate such as a printed circuit board. When the LED package is mounted on the mounting substrate via solder, if the amount of solder is different between the electrodes, there are problems in that one electrode floats due to the difference in surface tension when the solder melts or the shrinkage stress when the solder solidifies. The Manhattan phenomenon occurred. In order to solve the above-mentioned problem, the technique described in JP 2000-216440 A (hereinafter referred to as Patent Document 1) has been proposed. [0003] Patent Docum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48
CPCH05K2201/0311H01L2924/0002H01L33/486H05K2201/10106H01L2224/48091H05K3/3442H05K2201/10962H05K2201/10636H05K3/326H05K2201/1031H05K3/301H01L2224/48227Y02P70/50H01L2924/00014
Inventor 武藤正英内野野良幸吉田浩之进藤崇佐藤正博西罗丰梶纪公
Owner MATSUSHITA ELECTRIC WORKS LTD