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Fluid injection device

A technology of fluid injection and flow channel, which is applied in the direction of liquid injection devices, injection devices, injection devices, etc., can solve the problems of poor substrate treatment, lower fluid injection efficiency, adsorption to fluid injection devices, etc., achieve low production costs, improve injection Efficiency, easy processing effect

Active Publication Date: 2011-11-09
WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the process of gas spraying from the gas chamber to the spray pipe, some gas is not sprayed to the outside of the spray pipe at the position where the connecting pipe on the side of the liquid chamber is connected to the spray pipe, but is in contact with the end wall of the connecting pipe from which the liquid flows out. Collision, thus changing the direction of movement, instead into the liquid chamber with weaker pressure, this phenomenon will reduce the efficiency of fluid injection
[0006] Moreover, the bottom surface of the existing fluid ejection device is flat, so when the mixed fluid is sprayed onto the substrate, a negative pressure will be generated around the sprayed fluid, so that the substrate is adsorbed to the fluid ejection device, which will cause substrate processing. bad question

Method used

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Examples

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Embodiment Construction

[0026] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] figure 1 It is an external structure diagram for explaining an embodiment of the fluid ejection device of the present invention.

[0028] The fluid injection device has a long slit, which can spray the mixed fluid of liquid (DI Water) and gas (CDA, Clean Dry Air) mixed in the processing tank onto the substrate G to clean the substrate G. In the fluid ejection device, the first backing plate 1 and the second backing plate 3 are connected to each other by a connecting member 5 . Such as figure 2 and image 3 As shown, a spacer 7 is disposed between the first backer 1 and the second backer 3 .

[0029] A gas supply unit 2 is formed on the first backing plate 1 . The gas supply unit 2 may include a gas chamber 1a, and a gas supply channel 1b for transporting the gas in the gas chamber 1a. The gas chamber 1a is formed on the first back...

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Abstract

The invention relates to a fluid injection device capable of improving efficiency of fluid injection with simple production, which can be applied in substrate processing device for injecting a mixed fluid of liquid DIW and gas CDA onto a substrate for cleaning the substrate. The fluid injection device according to the invention includes a first base plate for forming a gas supply unit; a second base plate for forming a liquid supply unit and combining with the first base plate to compose a main body; a injection unit arranged on extremity of the mutually combined first base plate and second base plate for injecting mixed fluid; and a gap base plate arranged between the first base plate and the second base plate, and a connection flow passage for connecting the liquid supply unit and the injection unit is provided under the gap base plate.

Description

technical field [0001] The present invention relates to a kind of fluid jetting device, especially relates to a kind of can be applied in the substrate processing device to spray the mixed fluid of liquid (DIW) and gas (CDA) on the substrate to clean the substrate, and easy to manufacture, and can improve Fluid ejection devices for fluid ejection efficiency. Background technique [0002] In general, a fluid ejection device is applicable to a process of ejecting a mixed fluid to a substrate for cleaning the substrate. In such a fluid ejection device, a first backing plate formed with a gas chamber and a second backing plate formed with a liquid chamber overlap and are combined with each other by a connecting member. And, an injection duct for injecting gas (CDA, dry gas for cleaning) supplied to the gas chamber is formed between the first backing plate and the second backing plate. In addition, a plurality of connecting pipes arranged in an inclined state for connecting the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/02
CPCB05B1/044B05B7/0416B05B7/24B08B3/02B08B3/04
Inventor 李承俊朴镐胤
Owner WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD