Chip fuse and process for producing the same

A fuse and chip technology, which is applied in the manufacture of fuses, electrical components, circuits, etc., can solve the problems of no specific research, no disclosure of heat release devices or methods for fuse elements, etc., and achieve good precision and good thickness uniformity Effect

Active Publication Date: 2013-03-20
KAMAYA ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in Patent Document 2, there is no specific study on the material or heat transfer area of ​​the components around the fuse element, and there is no disclosure of a device or method for controlling the heat radiation from the fuse element to the surrounding components.

Method used

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  • Chip fuse and process for producing the same
  • Chip fuse and process for producing the same
  • Chip fuse and process for producing the same

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Embodiment Construction

[0033] Hereinafter, an embodiment of the present invention will be described with reference to the drawings, but the present invention is not limited to this.

[0034] figure 1 (a)~(d) and figure 2 (e) to (h) are plan views showing the steps of manufacturing the chip fuse 10 of the present invention, image 3 (a) is along figure 2 (h) A cross-sectional view of the chip fuse 10 on the A-A line, image 3 (b) is along figure 2 (h) A cross-sectional view of the chip fuse 10 along the B-B line.

[0035] In the chip fuse 10, a first heat storage layer 12 made of a film material with low thermal conductivity is formed on an insulating substrate 11, and a fuse film 13 is provided on the first heat storage layer 12. It has surface electrode portions 13a arranged at both ends and a fuse element portion 13b formed with a relatively narrow width so as to connect the surface electrode portions 13a at these ends. A part of the surface electrode portion 13a and the fuse element portion 13b Ni ...

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Abstract

A chip fuse that not restricted in the degree of freedom of fusing characteristics, realizes prevention of shortening of fusing time at large magnification with respect to rated current and attainment of shortening of fusing time at small magnification with respect to rated current. A chip fuse (10) has a first heat storage layer (12) of film material with low thermal conductivity superimposed on an insulating substrate (11) and has a fuse film (13) superimposed on the first heat storage layer (12) so as to avoid contact with the insulating substrate (11). The fuse film (13) has a fuse element part (13b) interposed between surface electrode parts (13a) disposed at both edges thereof. A second heat storage layer (15) of film material with low thermal conductivity is superimposed on the fuse element part (13b). The first heat storage layer (12) is thicker than the second heat storage layer (15). The first heat storage layer (12) and second heat storage layer (15) are those produced from a sheet material of B-stage state containing a photosensitive group.

Description

Technical field [0001] The present invention relates to a chip fuse and a method of manufacturing the same, and more particularly to a chip fuse in which the upper and lower layers of a fuse element portion are formed of a film with low thermal conductivity, and a method of manufacturing the same. Background technique [0002] Regarding chip fuses, as a technique that has already been disclosed, for example, there is a technique described in Patent Document 1. Wherein, a silicone resin film is formed on the upper surface of the inorganic substrate, a fuse film is formed on the silicone resin film, and a protective film is formed of silicone resin on the fuse film, as the thickness of the silicone resin film on the upper surface of the substrate , The example is 10μm. [0003] In Patent Document 1, it has been described that the use of silicone resin to prevent the solder of the connection portion with the printed wiring board from melting and burning, but even if the material of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H85/045H01H69/02H01H85/0445H01H85/046H01H85/10H01H85/17
CPCH01H85/006H01H85/0411H01H2085/0283H01H85/0065H01H2085/0414H01H85/10H01H85/046H01H69/02H01H85/00
Inventor 山岸克哉清野英树佐藤仁
Owner KAMAYA ELECTRIC
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