Multi-heat pipe cooling module and manufacturing method thereof

A technology of a heat dissipation module and a manufacturing method, which is applied to lighting and heating equipment, cooling/heating devices for lighting devices, electrical components, etc., can solve problems such as deformation, bending, difficulty in piercing heat pipes, and difficulty in piercing.

Inactive Publication Date: 2010-02-03
白豪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, it is not easy to provide the penetration of heat pipes due to the conventional columnar heat conduction seat or heat conduction block; because the heat supply pipe on the heat conduction seat or heat conduction block penetrates through its axial direction, the hole for the heat supply pipe to penetrate is also It has a deep depth, so if the heat pipe and the perforation are combined in a tight manner, it is limited that the outer diameter of the heat pipe is equivalent to the inner diameter of the perforation hole, and it is difficult for the heat pipe to penetrate into the perforation
In particular, the body of the heat pipe is mostly made of copper, which is easily deformed and bent by external pressure, which will affect the adhesion between the internal capillary tissue and the inner wall of the tube.
Therefore, the columnar heat transfer seat or heat transfer block in the past is not easy to penetrate the heat pipe.

Method used

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  • Multi-heat pipe cooling module and manufacturing method thereof
  • Multi-heat pipe cooling module and manufacturing method thereof
  • Multi-heat pipe cooling module and manufacturing method thereof

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Embodiment Construction

[0036] In order to enable those skilled in the art to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention. .

[0037] The invention provides a multi-heat pipe cooling module and a manufacturing method thereof. see figure 1 Step S1, providing a conduction column and two or more heat pipes, and the conduction column is provided with two or more perforations along its lateral circumference, and each of the perforations is arranged around its lateral circumference A thin-walled area is formed between; and cooperate with figure 2 As shown: firstly, a heat conduction base 1 and two or more heat pipes 2 are provided, and the heat conduction base 1 has the following structural features:

[0038] Such as image...

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Abstract

The invention provides a multi-heat pipe cooling module and a manufacturing method thereof. The method comprises the following steps: firstly, providing a conductive column and two or more heat pipes,wherein the conductive column is provided with two or more perforations in circular arrangement along the lateral periphery; forming a thin-wall area between the lateral periphery and each of the perforations; and then, penetrating one end of each of the heat pipes into the perforations respectively to extrude the end of each of the heat pipes and the corresponding thin-wall area from the outsideof the conductive column so as to make the inner wall of each of the perforations tightly fit with the outer wall of each of the heat pipes, and the aim of making the heat pipes tightly contact the inner walls of the perforations is achieved.

Description

technical field [0001] The invention relates to a heat dissipation module and a manufacturing method thereof, in particular to a heat conduction module which can be applied to light-emitting diode (LED) lamps for heat dissipation. Background technique [0002] The heat dissipation structure currently used in LED lamps has gradually changed its type in order to apply the high heat problem of LEDs. It is different from the heat dissipation device generally used on computer CPUs, just as the applicant has already applied to Taiwan, China for the announcement No. M300866 New patent case of "multi-heat pipe heat dissipation structure for LED lamps". [0003] However, it is not easy to provide the penetration of heat pipes due to the conventional columnar heat conduction seat or heat conduction block; because the heat supply pipe on the heat conduction seat or heat conduction block penetrates through its axial direction, the hole for the heat supply pipe to penetrate is also It h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00H01L23/427H01L33/00F21Y101/02F21V29/51F21V29/76
Inventor 白豪
Owner 白豪
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