Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A die-bonding film, polymer technology, applied in pressure-sensitive films/sheets, polyurea/polyurethane adhesives, film/sheet-like adhesives, etc. , can not easily pick up semiconductor chips, etc., to achieve good pick-up and prevent the disappearance of the boundary interface
Inactive Publication Date: 2010-02-10
NITTO DENKO CORP
View PDF4 Cites 11 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0006] However, with this improvement method, it may be difficult to obtain a dicing / die-bonding film that has a good balance between the holding force during dicing and the subsequent peelability.
For example, in the case of a large semiconductor chip of 10 mm x 10 mm or more or an extremely thin semiconductor chip of 25 to 50 μm, a general die bonder cannot easily pick up a semiconductor chip due to its large area
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0095]
[0096] In a reaction vessel with a condenser tube, a nitrogen inlet tube, a thermometer and a stirring device, add 51.7 parts of 2-ethylhexyl acrylate (hereinafter referred to as "2EHA"), 39.0 parts of stearyl acrylate (hereinafter referred to as "SA ”), 9.3 parts of 2-hydroxyethyl acrylate (hereinafter referred to as “HEA”), 0.2 parts of benzoyl peroxide and 65 parts of toluene were polymerized at 61°C for 6 hours in a nitrogen stream to obtain a weight-average Acrylic polymer A with a molecular weight of 580,000. The weight average molecular weight is as follows. The molar ratio of 2EHA to SA to HEA is 70 moles to 30 moles to 20 moles.
[0097] 10.0 parts (80 mol % with respect to HEA) of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as "MOI") was added to this acrylic polymer A, and the reaction was carried out at 50° C. for 48 hours in an air stream. Addition reaction treatment gave acrylic polymer A'.
[0098] Then, 8 parts of polyisocyanate com...
Embodiment 2～15
[0114] About each Examples 2-15, except having changed to the composition and compounding ratio shown in following Table 1, it carried out similarly to the said Example 1, and produced the dicing / die-bonding film.
[0115]
[0116] In addition, the meanings of the abbreviations described in Table 1 and Table 2 described later are as follows.
[0117] 2EHA: 2-Ethylhexyl Acrylate
[0118] i-OA: Isooctyl acrylate
[0119] SA: stearyl acrylate
[0120] VA: behenyl acrylate
[0121] BA: n-butyl acrylate
[0122] HEA: 2-Hydroxyethyl Acrylate
[0123] 4HBA: 4-Hydroxybutyl Acrylate
[0124] AOI: 2-acryloyloxyethyl isocyanate
[0125] C / L: polyisocyanate compound (trade name "Coroneto L", manufactured by Nippon Polyurethane Co., Ltd.)
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Property
Measurement
Unit
thickness
aaaaa
aaaaa
Login to view more
Abstract
A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH2-CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), an acrylic ester B represented by CH2-CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer to 100 mol % of the total of the acrylic ester A and the acrylic ester B, 70-90 mol % isocyanatecompound to 100 mol % of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.
Description
technical field [0001] The present invention relates to a dicing / die-bonding film used for dicing a workpiece in a state where an adhesive for fixing a chip-shaped workpiece (semiconductor chip, etc.) and an electrode member is attached to the workpiece (semiconductor wafer, etc.) before dicing. Background technique [0002] The semiconductor wafer (work) on which the circuit pattern is formed is adjusted in thickness by back grinding as necessary, and then diced into semiconductor chips (chip-shaped workpieces) (dicing step). In the cutting process, generally in order to remove the cut-off layer under moderate hydraulic pressure (usually about 2kg / cm 2 ) to clean the semiconductor chip. Then, the semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (mounting step), and then moves to a bonding step. In the mounting process, an adhesive is applied to a lead frame or a semiconductor chip. However, in this method, uniformization of the adhesive la...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more