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Dicing die-bonding film

A die-bonding film, polymer technology, applied in pressure-sensitive films/sheets, polyurea/polyurethane adhesives, film/sheet-like adhesives, etc. , can not easily pick up semiconductor chips, etc., to achieve good pick-up and prevent the disappearance of the boundary interface

Inactive Publication Date: 2010-02-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, with this improvement method, it may be difficult to obtain a dicing / die-bonding film that has a good balance between the holding force during dicing and the subsequent peelability.
For example, in the case of a large semiconductor chip of 10 mm x 10 mm or more or an extremely thin semiconductor chip of 25 to 50 μm, a general die bonder cannot easily pick up a semiconductor chip due to its large area

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095]

[0096] In a reaction vessel with a condenser tube, a nitrogen inlet tube, a thermometer and a stirring device, add 51.7 parts of 2-ethylhexyl acrylate (hereinafter referred to as "2EHA"), 39.0 parts of stearyl acrylate (hereinafter referred to as "SA ”), 9.3 parts of 2-hydroxyethyl acrylate (hereinafter referred to as “HEA”), 0.2 parts of benzoyl peroxide and 65 parts of toluene were polymerized at 61°C for 6 hours in a nitrogen stream to obtain a weight-average Acrylic polymer A with a molecular weight of 580,000. The weight average molecular weight is as follows. The molar ratio of 2EHA to SA to HEA is 70 moles to 30 moles to 20 moles.

[0097] 10.0 parts (80 mol % with respect to HEA) of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as "MOI") was added to this acrylic polymer A, and the reaction was carried out at 50° C. for 48 hours in an air stream. Addition reaction treatment gave acrylic polymer A'.

[0098] Then, 8 parts of polyisocyanate com...

Embodiment 2～15

[0114] About each Examples 2-15, except having changed to the composition and compounding ratio shown in following Table 1, it carried out similarly to the said Example 1, and produced the dicing / die-bonding film.

[0115]

[0116] In addition, the meanings of the abbreviations described in Table 1 and Table 2 described later are as follows.

[0117] 2EHA: 2-Ethylhexyl Acrylate

[0118] i-OA: Isooctyl acrylate

[0119] SA: stearyl acrylate

[0120] VA: behenyl acrylate

[0121] BA: n-butyl acrylate

[0122] HEA: 2-Hydroxyethyl Acrylate

[0123] 4HBA: 4-Hydroxybutyl Acrylate

[0124] AOI: 2-acryloyloxyethyl isocyanate

[0125] C / L: polyisocyanate compound (trade name "Coroneto L", manufactured by Nippon Polyurethane Co., Ltd.)

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Abstract

A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH2-CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), an acrylic ester B represented by CH2-CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer to 100 mol % of the total of the acrylic ester A and the acrylic ester B, 70-90 mol % isocyanatecompound to 100 mol % of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.

Description

technical field [0001] The present invention relates to a dicing / die-bonding film used for dicing a workpiece in a state where an adhesive for fixing a chip-shaped workpiece (semiconductor chip, etc.) and an electrode member is attached to the workpiece (semiconductor wafer, etc.) before dicing. Background technique [0002] The semiconductor wafer (work) on which the circuit pattern is formed is adjusted in thickness by back grinding as necessary, and then diced into semiconductor chips (chip-shaped workpieces) (dicing step). In the cutting process, generally in order to remove the cut-off layer under moderate hydraulic pressure (usually about 2kg / cm 2 ) to clean the semiconductor chip. Then, the semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (mounting step), and then moves to a bonding step. In the mounting process, an adhesive is applied to a lead frame or a semiconductor chip. However, in this method, uniformization of the adhesive la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L21/48H01L21/78H01L21/50C09J133/04C09J7/22C09J7/30C09J7/38
CPCC09J133/08H01L2224/83855H01L21/6836H01L24/29H01L2224/73265H01L2924/01016C09J2203/326H01L2924/01015C09J2201/36H01L2224/48091H01L2924/01005C09J2433/00C08L2205/02H01L2924/01013H01L2924/01056H01L2924/19042H01L2224/2919H01L2224/92247H01L2224/83191H01L2224/48247C09J7/0239H01L2924/0665H01L2924/01051H01L2924/07802H01L2924/01027H01L24/83H01L24/85H01L2224/32225H01L2924/15747C09J2463/00C09J7/0246H01L2924/01047C08L33/08H01L2924/01006H01L2924/3025C09J2205/31H01L2924/01079H01L2924/01074H01L2224/32245H01L2924/01082H01L2224/85H01L2221/68327H01L2924/01029C09J163/00H01L24/27H01L2924/01019H01L2224/48227C09J2201/606H01L2224/92H01L2924/01033H01L2924/15788H01L2924/181H01L24/73H01L2924/00014H01L24/48C09J7/38C09J7/22C09J7/30C08L2666/04Y10T428/31511C09J2301/208C09J2301/416C09J2301/302H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099C09J175/00H01L21/30H01L21/78
Inventor 神谷克彦松村健村田修平大竹宏尚
Owner NITTO DENKO CORP
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