Joint surface detecting structure and joint surface detecting method
A technology for detecting structures and methods, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problem that the flip-chip manufacturing process does not meet the manufacturing process specifications, the flip-chip manufacturing process does not meet the specifications, and the manufacturing process precision connection bumps Pressing deformation does not meet the manufacturing process specifications and other issues
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[0048] A joint surface detection structure and a joint surface detection method according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.
[0049] figure 2 It is a schematic side view of a chip on glass (COG) structure of the present invention. Please refer to figure 2 As shown, the chip-on-glass structure 20 includes a chip 22 and a glass substrate 21 . The chip 22 is mainly intended to be electrically connected to an electrical connection pad (pad) of a circuit on the glass substrate 21. In this embodiment, a plurality of connection bumps 25 are arranged between the chip 22 and the glass substrate 21, which can be pre-installed. The electrical connection pads disposed on the glass substrate 21 may be pre-disposed on a surface of the chip 22 , wherein the connection bumps 25 are, for example, solder balls or gold bumps.
[0050] In or...
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