Copper surface treating agent and surface treatment method
A treatment method, copper surface technology, applied in electrical components, welding/welding/cutting items, printed circuit manufacturing, etc., can solve problems such as heat resistance and solderability that are difficult to meet
Inactive Publication Date: 2010-03-10
MEC CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
In addition, solderability must be maintained, but conventional copper surface treatment agents have been difficult to satisfy both heat resistance and solderability
Method used
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[0055] Hereinafter, the present invention will be further specifically described using examples.
[0056]
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Abstract
Disclosed is a copper surface treating agent satisfying both heat resistance and solderability. Also disclosed is a surface treatment method. Specifically disclosed is a copper surface treating agentcontaining an acid, a benzimidazole compound and water, which is characterized in that at least a first benzimidazole compound and a second benzimidazole compound having a melting point lower than that of the first benzimidazole compound by 70 DEG C or more are contained as the benzimidazole compound.
Description
technical field [0001] The invention relates to a copper surface treatment agent and a surface treatment method using the same. Background technique [0002] The surface treatment agent for copper is used for the purpose of forming a film on the surface of copper on which wiring is formed, for example, to improve rust resistance and solderability. As said surface treatment agent, it is known to contain an imidazole compound which becomes a main component of the formed film. For example, Patent Document 1 discloses that a 2-alkylbenzimidazole compound and an organic acid are used in combination. Patent Documents 2 to 4 disclose surfactants containing imidazole compounds. Patent Document 5 discloses a method of using a precoat flux containing an imidazole compound. In Patent Document 6, two types of imidazole compounds containing 4,4-methylene-bis-(2-undecyl-5-methylimidazole) and 2-undecyl-4-methylimidazole are disclosed. copper surface treatment agent. Patent Document 7...
Claims
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Login to View More IPC IPC(8): C23F11/00B23K1/20
CPCB23K1/20C23F11/149C23C22/52B23K2203/12H05K2203/124H05K3/282B23K2103/12
Inventor 矢熊纪子古川良昭东嶋丰惠
Owner MEC CO LTD