Method and system for monitoring abnormities in the technique process

A process and abnormal technology, applied in the abnormal field in the monitoring process, can solve problems such as affecting the monitoring accuracy, and achieve the effect of reducing unnecessary alarms, improving work efficiency, and reducing negative feelings.

Active Publication Date: 2010-03-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The technical problem to be solved by the present invention is to provide a method and system for monitoring abnormalities in the process, so as to solve the problem of normal The situation also throws an alarm, which affects the monitoring accuracy

Method used

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  • Method and system for monitoring abnormities in the technique process
  • Method and system for monitoring abnormities in the technique process

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0051] refer to figure 2 , is a flowchart of a method for monitoring abnormalities in a process described in Embodiment 1 of the present invention.

[0052] Step 201, cyclically detect and obtain the state variable value of the target device;

[0053] Cyclic detection refers to repeatedly detecting the state variables of the target device according to a certain time interval.

[0054] The target device refers to a device that needs to be monitored for abnormality, and whether the device is normal is monitored by detecting the target device and obtaining a corresponding state variable value. Different target devices have different state variables that need to be monitored. For example, device A needs to monitor temperature variables, and device B needs to monitor pH variables; moreover, the same target device also has multiple state variables that need to be monitored. For example, device C needs to monitor simultaneously Temperature and pH variables.

[0055] It should be no...

Embodiment 2

[0072] This embodiment is described through a specific implementation manner.

[0073] refer to image 3 , is a flowchart of a method for monitoring abnormalities in a process described in Embodiment 2 of the present invention. This embodiment is also described by taking the monitoring of a state variable as an example.

[0074] Step 301, start abnormality monitoring;

[0075] Step 302, setting the initial value of abnormal times;

[0076] That is, the initialization operation is performed, for example, the initial value of the number of exceptions can be set to 0;

[0077] Step 303, obtaining a preset cycle detection interval time;

[0078] Step 304, acquiring a preset tolerance time;

[0079] Wherein steps 303 and 304 do not limit the sequential acquisition sequence;

[0080] Step 305, obtaining the state variable value of the target device;

[0081] Step 306, comparing the value of the state variable with a preset condition;

[0082] That is, it is judged whether th...

Embodiment 3

[0100] Based on the above method embodiments, the present invention also provides corresponding system embodiments.

[0101] refer to Figure 4 , is a structural diagram of a system for monitoring abnormalities in a process described in Embodiment 3 of the present invention. The system mainly includes:

[0102] A device state acquisition unit 41, configured to loop detection and obtain the state variable value of the target device;

[0103] An abnormality monitoring unit 42, configured to check whether the value of the state variable meets a preset condition within a preset tolerance time during each detection;

[0104] The alarm unit 43 is configured to issue an abnormal alarm when the state variable value does not meet the preset condition for a period exceeding the preset tolerance time.

[0105] The above abnormality monitoring system does not alarm for tolerable abnormalities, thereby improving the accuracy of abnormality monitoring. Moreover, it helps to improve the ...

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Abstract

The invention provides a method and a system for monitoring abnormities in the technique process, aiming at solving the problem that the existing monitoring method also can give out alarm for certainnormal conditions of the equipment so as to influence monitoring accuracy. The method comprises the following steps: circularly detecting and acquiring a state variable value of a target device; viewing whether the state variable value meets a preset condition in preset tolerance time when in each detection; if the time without meeting the preset condition excesses the tolerance time, an alarm isgiven on abnormity. The invention can discriminate abnormities in short time (namely normal condition of certain equipment), and does not alarm frequently, thus improving the accuracy rate of the abnormal monitoring and is beneficial to improving the work efficiency of operators and maintainers of the equipment.

Description

technical field [0001] The invention relates to the field of process control, in particular to a method and system for monitoring abnormalities in the process. Background technique [0002] In the process of semiconductor manufacturing, the requirements for most environmental parameters are very strict, and their values ​​must be controlled within a certain range. If they exceed this range, it indicates that the equipment has malfunctioned or other problems, and an alarm must be thrown at this time. Prompt the operator so that corresponding processing can be done as soon as possible. [0003] At present, in semiconductor equipment control software, overrun interlock (Overrun Interlock) is generally used to deal with equipment state values ​​exceeding the range. refer to figure 1 , the workflow of value interlock is as follows: [0004] Step 101, the device software starts; [0005] The device software refers to device control software, [0006] Step 102, obtaining the v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/048
Inventor 王永贵
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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