Front-open wafer box with integrally formed wafer limiting piece module

Abstract

The invention relates to a front-open wafer box which mainly comprises a box body and a door body. A plurality of slots are arranged in the box body to accommodate a plurality of wafers, and an opening is formed at a side surface of the box body so as to input and output the plurality of wafers; and the door body is provided with an external surface and an internal surface, and has the function ofprotecting the plurality of wafers inside the box body by combining the internal surface with the opening of the box body. The front-open wafer box is characterized in that the door body is providedwith a sunken area integrally on the internal surface in order to divide the internal surface into two convex platforms; a limiting piece module is formed on each of the two convex platforms; each limiting piece module comprises a base; a plurality of grooves which are arranged at intervals are arranged on the base and are contacted with the plurality of wafers via the plurality of grooves.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a door body and a wafer restricting piece which are integrally formed on the protruding platform on both sides of the recessed area on the inner surface of the door. In addition to shortening the size of the front-loading wafer box, the wafer can also be firmly supported by the wafer restraint to prevent the wafer from moving during transportation. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to coordinate with the process. In order to facilitate the handling of the wafers and avoid contamination from the outside, a sealed container is often used for delivery by automated equipment. Please refer to figure 1 Shown is a schematic diagram of a wafer box in the prior art. This wafer box is a front opening type wafer box (Front Opening Unified Pod, FOUP), which has a box body ...

AI Technical Summary

Problems solved by technology

[0004] According to the prior art wafer box, the wafer restricting parts are likely to cause problems such as the inability to reduce the size of the wafer box, difficulty in cleaning and loosening of particles and dust, and so on. A main purpose of the present invention is to provide a door body formed in an integrated manner Each groove of the wafer restraint module on the protruding platform on the surface of the door body located on both sides of the recessed area can be relatively aligned with the groove of the wafer part module on the other protruding platform, which can improve the contact between the wafer and the wafer. Accuracy when groove contacts

Images