Electrostatic chucking apparatus and method for manufacturing the same

Abstract

An electrostatic chucking apparatus and a method for manufacturing the same is disclosed, which is capable of enabling the increase of lifetime of an electrostatic chuck and realizing a uniform temperature gradient in an entire substrate by preventing an insulating material from being etched, the electrostatic chucking apparatus comprising a base member; and an electrostatic chuck, loaded onto the base member, for chucking a substrate by an electrostatic force, wherein the electrostatic chuck comprises an insulating member formed on the base member and provided with a plurality of first insulating sheets of aluminum nitride; a heater for heating the substrate, the heater positioned among the plurality of first insulating sheets; a direct current electrode formed on at least one first insulating sheet provided above the heater among the plurality of first insulating sheets, the DC electrode electrically connected with a direct current power source; and an insulator etch stopping layer, formed of aluminum oxide on an entire surface of the insulating member, for preventing the insulating member from being etched.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. P2008-0105949 filed on October 28, 2008, which is hereby incorporated by reference as if fully set forth herein. technical field [0003] The present invention relates to an electrostatic chuck and a manufacturing method thereof, more particularly, to an electrostatic chuck device and a manufacturing method thereof, the electrostatic chuck device can prolong the service life of the electrostatic chuck by preventing the insulating material from being etched, and A uniform temperature gradient across the entire substrate is achieved. Background technique [0004] Generally speaking, semiconductor devices, flat panel display devices or solar cells can be fabricated through the processes of oxidation, deposition and etching. These processes are performed with the substrate fixedly loaded on the chamber. In order to securely load the substrate onto the c...

AI Technical Summary

Problems solved by technology

Due to the short life of the electrostatic chuck 20, the electrostatic chuck 20 has to be replaced frequently, thus reducing productivity and increasing maintenance costs

[0013] Due to the different thermal conductivity of the base member 10 and the insulating member 22 of the electrostatic chuck 20, and the distance of the channel 15 from the substrate, it is difficult to achieve a uniform temperature across the substrate

Also, it is difficult to achieve a uniform temperature gradient across the substrate due to imprecise temperature regulation in the substrate

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