Heat radiation assembly fastener and heat radiation device

A technology for heat dissipation components and heat dissipation devices, which is applied to electrical components, electric solid state devices, semiconductor devices, etc., and can solve the problems of large inventory and troublesome materials.

CN101730442AInactive Publication Date: 2010-06-09PEGATRON
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2010-06-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a heat radiation assembly fastener which is matched with multiple locking assemblies and a circuit board with multiple penetrating holes to fasten a heat radiation assembly on the circuit board. The heat radiation assembly fastener comprises a frame body, multiple positioning components and multiple positioning sleeve components, wherein the frame body is used for being sleeved with the heat radiation assembly; the positioning components are positioned at the side of the frame body, each positioning component comprises a positioning hole, the positions of the positioning holes correspond to the positions of the multiple penetrating holes of the circuit board, and each positioning hole comprises multiple positioning parts; the positioning sleeve components are respectively arranged in the multiple positioning holes and are clamped in one of the multiple positioning parts, so that the multiple locking assemblies can be fixed on the circuit board by penetrating through the corresponding positioning holes and the corresponding penetrating holes, and the heat radiation assemblies can be fastened to the circuit board. The invention also discloses a heat radiation device.
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Description

technical field

[0001] The invention relates to a fastener for a heat dissipation component and a heat dissipation device, in particular to a fastener for a heat dissipation component and a heat dissipation device that can be used for sockets of different specifications. Background technique

[0002] With the vigorous and rapid development of the electronic industry, the transistor density of the central processing unit (CPU) is increasing day by day. Although the operating frequency is getting higher and higher, the power consumption and heat generation are also increasing. In order to allow the central processing unit to operate stably, a heat sink consisting of multiple fins is arranged on the central processing unit, and a fan can be arranged on the heat sink, so that most of the heat generated by the central processing unit during calculation can be absorbed by the heat sink. Absorption, and at the same time start the fan operation to enhance the cooling effect of the h...

Examples

Embodiment Construction

[0022] see Figure 1 to Figure 6B As shown, it is the heat dissipation device disclosed in the first embodiment of the present invention. The heat dissipation device 1 is arranged on a circuit board 5 with electronic components 51. The circuit board 5 is provided with a plurality of through holes 52 on the side where the electronic components 51 are disposed. Here, the electronic component 51 can be a central processing unit (CPU), but it is not limited thereto. The present invention can also be arranged on other electronic components that generate heat to provide heat dissipation. In addition, the electronic component 51 can be pre-welded on the circuit board 5 , or mounted on the base (Socket) 55 of the circuit board 5 . The heat dissipation device 1 includes a heat dissipation component 11 , a fastener 12 for the heat dissipation component, a plurality of locking components 15 , and a plurality of positioning kits 16 .

[0023] The heat dissipation component 11 is located ...