Semiconductor device and method for producing semiconductor device

Abstract

A semiconductor device includes: a substrate having an external electrode formed thereon, the external electrode being capable of being electrically connected to an outside; and a semiconductor element having a surface electrode formed thereon, the surface electrode being made from an electrically conducting paste, the semiconductor element being mounted on the substrate, the external electrode being electrically connected by wire bonding to the surface electrode via a connecting member. This provides (i) a semiconductor device including: a substrate having an external electrode capable of being electrically connected to an outside; and a semiconductor element having a surface electrode made from an electrically conducting paste, the semiconductor device allowing for assured bonding reliability and a simplified means or step of connecting the surface electrode to the external electrode, and (ii) a method for producing the semiconductor device.

Description

technical field [0001] The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device, and in particular to a technique for connecting surface electrodes of a semiconductor element having no wiring layer inside the element, such as a solar cell, to external electrodes of a base material on which the semiconductor element is mounted, by wire bonding. Background technique [0002] Conventionally, a semiconductor device in which a semiconductor element mounted on a base material is resin-sealed is known. In such a semiconductor device, the base material has external electrodes such as lead terminals that can be electrically connected to the outside of the semiconductor device on the bonding surface with the semiconductor element. In addition, the semiconductor element has surface electrodes electrically connected to the external electrodes of the base material on the surface opposite to the bonding surface with the base material. ...

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Problems solved by technology

[0013] However, in the conventional semiconductor device 100, since the flux (flux) is applied before the aluminum strip 107 is soldered, cleaning must be performed after reflow bonding to remove the flux.

In addition, since it is necessary to heat the aluminum strip 107 in a fixed state, it is necessary to provide a fixing jig for the aluminum strip 107.

Therefore, there is a problem that many man-hours (processes) are required to connect the surface electrodes 106 of the semiconductor element 105 to the external electrodes 103 of the base material 101.

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