Semiconductor device
A semiconductor and substrate technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as difficulty in ensuring the reliability of the connection between through electrodes and electrode pads
Inactive Publication Date: 2011-06-22
FUJIKURA LTD
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Problems solved by technology
[0010] As described above, in the conventional semiconductor device, when the electrode pads are arranged near the edge of the chip (the edge of the scribe line), it is difficult to ensure the bonding reliability between the through-electrodes on the front surface side of the semiconductor substrate and the electrode pads. In addition, it is difficult to avoid contact and interference between the cover resin (sealing resin) on the back of the semiconductor substrate or the land portion and the edge of the chip (scribe line edge)
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[0022] Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made within the range not departing from the gist of the present invention.
[0023] figure 1 It is a partial plan view of the semiconductor device 1 according to one embodiment of the present invention seen from the rear surface 2 b side of the semiconductor substrate 2 . in addition, figure 2 yes figure 1 Sectional view of S-S in . figure 1 and figure 2 The illustrated semiconductor device 1 includes a semiconductor substrate 2 on which a through hole 5 is formed, an interlayer insulating film 3, an electrode pad 4, an insulating layer 6, a bump electrode wiring 7, a penetrating electrode 8, a land portion 9, and a sealing resin. (covering resin) 11 , solder bump 12 , protective film (passivation film) 13 . In this semiconductor device 1 , the electrode pad 4 is electrically connected to the ...
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Provided is a semiconductor device including: a semiconductor substrate having a through hole formed toward one side from the other side; an electrode pad arranged on the first side of the semiconductor substrate and partially exposed to the through hole; and a through electrode arranged inside the through hole and electrically connected to the electrode pad. The connection portion between the electrode pad and the through electrode is arranged in a region of the electrode pad plane near to the center of the semiconductor substrate rather than to the center region of the electrode pad.
Description
technical field [0001] The present invention relates to a semiconductor device provided with through electrodes. [0002] This application claims the priority of Japanese Patent Application No. 2008-203395 for which it applied in Japan on August 6, 2008, and uses the content here. Background technique [0003] In recent years, the multifunctionalization of electronic devices such as mobile phones has been continuously developed. In electronic devices such as ICs and LSIs used in these devices, and optical devices such as OEICs and optical pickups, they are used to realize the miniaturization or multifunctionalization of the devices themselves. The development of is in progress everywhere. For example, there has been proposed a technique in which such devices are stacked in electronic equipment. Specifically, there is a semiconductor device including a through-hole electrode that penetrates from the other surface of the substrate to the one surface of a substrate provided w...
Claims
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IPC IPC(8): H01L21/3205H01L23/12H01L23/52
CPCH01L2224/16H01L2924/01078H01L2924/01004H01L2224/13022H01L24/13H01L23/481H01L2924/1461H01L2924/12042H01L2924/14H01L2924/00
Inventor 和田英之
Owner FUJIKURA LTD