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2results about How to "Enough thickness" patented technology

FCCSP packaging structure, manufacturing method thereof and electronic device

PendingCN122270144AEfficient Dissipationenough thicknessHeat sinkEngineering physics
The application discloses a FCCSP packaging structure and a manufacturing method thereof and electronic equipment, and belongs to the technical field of semiconductors, and comprises a substrate, a flip chip arranged on the surface of the substrate, a heat-conducting layer arranged on the surface of the flip chip, a heat sink bonded with the heat-conducting layer, and a plastic sealing layer covering the sidewall of the flip chip, the sidewall of the heat-conducting layer and the sidewall of the heat sink, wherein at least part of the heat sink is exposed to the plastic sealing layer. Compared with the prior art, the application combines the heat sink and the flip chip through the heat-conducting layer first, then performs overall plastic sealing and exposes the heat sink, thereby omitting the difficult step of etching and cutting the thick heat sink, so that the process is simplified and the overall profile height of the package is controlled under the premise that the heat sink has sufficient thickness to improve the heat dissipation efficiency.
Owner:成都芯忆联信息技术有限公司