3results about How to "Enough thickness" patented technology

The application discloses a FCCSP packaging structure and a manufacturing method thereof and electronic equipment, and belongs to the technical field of semiconductors, and comprises a substrate, a flip chip arranged on the surface of the substrate, a heat-conducting layer arranged on the surface of the flip chip, a heat sink bonded with the heat-conducting layer, and a plastic sealing layer covering the sidewall of the flip chip, the sidewall of the heat-conducting layer and the sidewall of the heat sink, wherein at least part of the heat sink is exposed to the plastic sealing layer. Compared with the prior art, the application combines the heat sink and the flip chip through the heat-conducting layer first, then performs overall plastic sealing and exposes the heat sink, thereby omitting the difficult step of etching and cutting the thick heat sink, so that the process is simplified and the overall profile height of the package is controlled under the premise that the heat sink has sufficient thickness to improve the heat dissipation efficiency.

The utility model relates to the technical field of batteries, and discloses a battery which comprises a shell, at least one end of the shell is open, and the shell wall of the shell is thinned at the open end so as to form at least one step structure in the shell; the cover plate blocks the opening and is welded to the shell, and the cover plate abuts against the step structure; wherein in the circumferential direction, surrounding the opening, of the shell, the perimeter of the shell is a, the total length of the step structure is b, and the formula that b / a is larger than or equal to 0.02 and smaller than or equal to 0.98 is met. According to the utility model, the ratio of the perimeter of the shell to the total length of the step structure is limited, so that the positioning effect of the step structure on the cover plate is ensured, the assembly quality and the welding quality of the cover plate and the shell are ensured, the shell wall of the opening end of the shell has enough thickness, and the service life of the shell is prolonged. Therefore, the structural strength of the shell is ensured, the welding requirements of the cover plate and the shell are met, and the problems of cracking of a welding wire and the like are avoided.

The application discloses a flexible simulation model and a manufacturing method thereof, and solves the problems of high cost and no support or easy layered damage of existing models by adopting a low-cost structure. The method comprises the following steps: mixing cement slurry and foaming medium to form a porous lightweight internal support base; and punching a connecting hole at a high position of the support base to insert an air guide pipe. After the support base is put into a mold, an external air pump is connected, and during injection of a flow state flexible material into a cavity space, negative pressure is opened to extract thermal expansion gas caused by material temperature. Air bubbles are exhausted by air pressure, and the fluid material which has not yet been solidified is forced to suck inward into the surface layer micro-pore of the porous support base and solidify and cross-link. The scheme extracts air on the support base, so that the flexible layer forms an anchoring bonding structure in the dense holes on the surface of the support base, and the external flexible layer is firmly combined with the support base, which not only significantly reduces the cost and enhances the real experience, but also is not easy to tear and damage.