The application discloses a FCCSP packaging structure and a manufacturing method thereof and
electronic equipment, and belongs to the technical field of semiconductors, and comprises a substrate, a
flip chip arranged on the surface of the substrate, a heat-conducting layer arranged on the surface of the
flip chip, a
heat sink bonded with the heat-conducting layer, and a plastic sealing layer covering the sidewall of the
flip chip, the sidewall of the heat-conducting layer and the sidewall of the
heat sink, wherein at least part of the
heat sink is exposed to the plastic sealing layer. Compared with the prior art, the application combines the heat sink and the flip
chip through the heat-conducting layer first, then performs overall plastic sealing and exposes the heat sink, thereby omitting the difficult step of
etching and
cutting the thick heat sink, so that the process is simplified and the overall profile height of the
package is controlled under the premise that the heat sink has sufficient thickness to improve the heat dissipation efficiency.