Multilayer chip capacitor

A multi-layer chip and capacitor technology, applied in the direction of laminated capacitors, capacitors, fixed capacitor dielectrics, etc.

Active Publication Date: 2009-12-09
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, when the capacitor main body is polished after sintering or when the manufactured multilayer chip capacitor is mounted on a substrate, the above-mentioned mechanical damage of the capacitor will often occur

Method used

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Embodiment

[0091] The present applicant conducted the following experiments to compare the ESL characteristics of conventional multilayer chip capacitors with multilayer chip capacitors according to three examples (first to third embodiments) of the present invention in order to observe the advantages of the present invention. Improvement of ESL characteristics of laminated chip capacitors. A conventional multilayer chip capacitor has an internal electrode structure as shown in FIG. 1a and a symmetrical cross-sectional structure as shown in FIG. 1c. The capacitors of the first to third examples have Figure 13 The internal electrode structure is shown. The multilayer chip capacitor of the first embodiment has Figure 4 As shown in the upper and lower asymmetric cross-sectional structure, the capacitor of the second embodiment has Figure 10 The upper and lower asymmetric cross-sectional structures shown, and the capacitor of the third embodiment have Figure 11 The upper and lower sym...

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Abstract

The present invention discloses a multilayer chip capacitor which can reduce low equivalent series inductance due to current flowing through external electrodes and can ensure improved mechanical strength. A multilayer chip capacitor includes an upper dummy layer and a lower dummy layer; a plurality of internal electrodes interposed between the upper dummy layer and the lower dummy layer; and external electrodes connected to the internal electrodes, wherein the thickness of the lower dummy layer is smaller than that of the upper dummy layer thickness of.

Description

[0001] related application [0002] This application claims priority from Korean Application No. 2005-5513 filed on January 20, 2005 and Korean Application No. 2004-16874 filed on February 28, 2005, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a multilayer chip capacitor, and more particularly, to a multilayer chip capacitor having low equivalent series inductance (ESL) in high frequency circuits. Background technique [0004] In general, a multilayer chip capacitor has a small size, realizes a high capacitance, and is easy to mount on a substrate, and thus is widely used in various electronic devices. Multilayer chip capacitors are used as capacitive elements in high-frequency circuits, especially as decoupling capacitors arranged in power supply circuits of LSIs. In order to use a multilayer chip capacitor in a high frequency circuit, the multilayer chip capacitor must have a low ESL value. W...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/02H01G4/12
CPCH01G2/065H01G4/12H01G4/30H05K3/3442
Inventor 李炳华沈昌勋丁海硕朴东锡朴祥秀朴珉哲
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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