Multilayer chip capacitor

Abstract

The present invention discloses a multilayer chip capacitor which can reduce low equivalent series inductance due to current flowing through external electrodes and can ensure improved mechanical strength. A multilayer chip capacitor includes an upper dummy layer and a lower dummy layer; a plurality of internal electrodes interposed between the upper dummy layer and the lower dummy layer; and external electrodes connected to the internal electrodes, wherein the thickness of the lower dummy layer is smaller than that of the upper dummy layer thickness of.

Description

[0001] related application [0002] This application claims priority from Korean Application No. 2005-5513 filed on January 20, 2005 and Korean Application No. 2004-16874 filed on February 28, 2005, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a multilayer chip capacitor, and more particularly, to a multilayer chip capacitor having low equivalent series inductance (ESL) in high frequency circuits. Background technique [0004] In general, a multilayer chip capacitor has a small size, realizes a high capacitance, and is easy to mount on a substrate, and thus is widely used in various electronic devices. Multilayer chip capacitors are used as capacitive elements in high-frequency circuits, especially as decoupling capacitors arranged in power supply circuits of LSIs. In order to use a multilayer chip capacitor in a high frequency circuit, the multilayer chip capacitor must have a low ESL value. W...

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Problems solved by technology

In particular, when the capacitor main body is polished after sintering or when the manufactured multilayer chip capacitor is mounted on a substrate, the above-mentioned mechanical damage of the capacitor will often occur

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