Multilayer chip capacitor

A multi-layer chip and capacitor technology, applied in the direction of laminated capacitors, capacitors, fixed capacitor dielectrics, etc.

Active Publication Date: 2006-07-26
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In particular, when the capacitor main body is polished after sintering or when the manufactured multilayer ch

Method used

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  • Multilayer chip capacitor
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Examples

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Example Embodiment

[0090] Example

[0091] The applicant conducted the following experiments to compare the ESL characteristics of conventional multilayer chip capacitors with multilayer chip capacitors according to three examples (first to third embodiments) of the present invention to observe the advantages of the present invention. Improvement of ESL characteristics of layered chip capacitors. The conventional multilayer chip capacitor has the internal electrode structure shown in FIG. 1a and the symmetrical cross-sectional structure shown in FIG. 1c. The capacitors of the first to third examples have Figure 13 The internal electrode structure shown. The multilayer chip capacitor of the first embodiment has Figure 4 The upper and lower asymmetrical cross-sectional structure shown, the capacitor of the second embodiment has Picture 10 The upper and lower asymmetrical cross-sectional structure shown, and the capacitor of the third embodiment has Picture 11 The top and bottom symmetrical cross-s...

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Abstract

A multilayer chip capacitor, which reduces ESL generated due to current flowing through external electrodes and assures an improved mechanical strength. The multilayer chip capacitor includes an upper dummy layer and a lower dummy layer; a plurality of internal electrodes interposed between the upper and lower dummy layers; and external electrodes connected to the internal electrodes, wherein the thickness of the lower dummy layer is smaller than the thickness of the upper dummy layer.

Description

[0001] related application [0002] This application claims priority from Korean Application No. 2005-5513 filed on January 20, 2005 and Korean Application No. 2004-16874 filed on February 28, 2005, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a multilayer chip capacitor, and more particularly, to a multilayer chip capacitor having low equivalent series inductance (ESL) in high frequency circuits. Background technique [0004] In general, a multilayer chip capacitor has a small size, realizes a high capacitance, and is easy to mount on a substrate, and thus is widely used in various electronic devices. Multilayer chip capacitors are used as capacitive elements in high-frequency circuits, especially as decoupling capacitors arranged in power supply circuits of LSIs. In order to use a multilayer chip capacitor in a high frequency circuit, the multilayer chip capacitor must have a low ESL value. W...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/02H01G4/12
CPCH01G2/065H01G4/12H01G4/30H05K3/3442
Inventor 李炳华沈昌勋丁海硕朴东锡朴祥秀朴珉哲
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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