Method for flattening film layer
A planarization and film layer technology, applied in the field of planarization, can solve the problems of good and bad connection pad quality, affecting thickness uniformity, etc.
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[0030] In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.
[0031] Figure 1A to Figure 1F It is a schematic cross-sectional view of a method for flattening a film layer according to an embodiment of the present invention. Please refer to Figure 1A Regarding the film planarization method of this embodiment, firstly, a circuit board 100 is provided. The circuit board 100 has a dielectric layer 110 and a patterned circuit layer 120 , wherein the dielectric layer 110 has a surface 112 , and the patterned circuit layer 120 is located on the surface 112 of the dielectric layer 110 .
[0032] It is worth mentioning that the structure of the circuit board 100 may have only one patterned circuit layer 120 , or may have multiple patterned circuit layers. That is, the circuit board 100 may be a single side circuit board, ...
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