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Radiating die set

A heat dissipation module and heat dissipation fin group technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of heat dissipation modules such as heavy weight, large volume, and difficulty in meeting the requirements of light and thin computers , to achieve the effect of simple structure, light and thin, and convenient assembly

Inactive Publication Date: 2010-06-23
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

The heat pipe, the fin group and the centrifugal fan are all arranged on a heat conducting plate body so as to be integrated into one body. However, this integrated heat dissipation module is heavy and bulky, which is difficult to meet the requirements of thinning and thinning the computer, and also makes the assembly process very difficult. complex

Method used

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  • Radiating die set
  • Radiating die set
  • Radiating die set

Examples

Experimental program
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Embodiment Construction

[0011] Please also see Figure 1 to Figure 3 , the cooling module includes a centrifugal fan 10 , a cooling fin set 20 and a plate-type heat pipe 30 .

[0012] The centrifugal fan 10 includes an upper cover 11 , a lower cover 12 , a side wall 13 and an impeller 14 . The upper cover 11 , the lower cover 12 and the side wall 13 enclose and form an accommodating space, and the impeller 14 is accommodated in the accommodating space.

[0013] The upper cover 11 is integrally formed with the heat pipe 30 , and a first air inlet 110 is formed in the middle of the upper cover 11 .

[0014] The outline of the lower cover 12 is similar to that of the upper cover 11 , and a second air inlet 120 is formed in the middle of the lower cover 12 corresponding to the first air inlet 110 . The side wall 13 is located on the outer periphery of the lower cover 12 and is vertically connected with the lower cover 12, so that the side wall 13 and the lower cover 12 encircle to form an accommodating...

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Abstract

The present invention relates to a radiating die set comprising a centrifugal fan and a plate-type heat pipe, wherein the centrifugal fan comprises an upper cover, a lower cover and an impeller between the upper cover and the lower cover; at least one air outlet is formed at the side of the centrifugal fan; the plate-type heat pipe comprises an upper shell and a lower shell opposite to the uppershell; the upper shell and the lower shell are covered together to form a sealing chamber; and one of the upper shell and the lower shell extends outward at an integrative way to form the upper coveror lower cover of the centrifugal fan.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module with a fan and a plate-type heat pipe. Background technique [0002] With the rapid development of the computer industry, the pursuit of high-speed CPU, multi-functional and miniaturized heat dissipation problems are becoming more and more serious, which is more prominent in electronic devices with small internal spaces such as notebook computers. If the heat generated by the electronic components such as the CPU in the notebook computer cannot be dissipated in a timely and effective manner, the performance of the electronic components will be greatly affected, and the service life of the electronic components will also be reduced. Therefore, the electronic components must be dissipated. [0003] At present, in a notebook computer, a heat dissipation module composed of a centrifugal fan, a fin set and a heat pipe is often used. For example, a Chinese patent a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/467H01L23/427
CPCH01L23/467H01L23/427H01L2924/0002H01L2924/00
Inventor 黄清白孟劲功赵志辉
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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