Electronic device and cooling device and cooling fins thereof

Abstract

The invention relates to an electronic device and a cooling device and cooling fins thereof. The cooling device comprises two heat-conducting plates and a plurality of cooling fins arranged between the two heat-conducting plates, wherein the two heat-conducting plates of the cooling device are separately connected with the shell of the electronic device and an electronic element arranged in the shell; and each cooling fin is prepared by bending a piece of flaky material and comprises two flat connection parts which are separately connected with the two heat-conducting plates and at least one bending part which is connected between the two connection parts, the bending part between the two connection parts has elastic stretching and shrinking function, the shape of the cooling fins can be changed according to demands of different installment spaces so that the cooling device is applicable to the demands of different installment spaces and has better spatial adaptability.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device and a heat dissipation fin for heat dissipation of electronic components of an electronic device. Background technique [0002] With the rapid development of the electronic information industry, portable electronic devices such as notebook computers, personal digital assistants, and multimedia mobile phones are also rapidly developing in the direction of high performance and multi-function. If the heat is not removed in time, it will cause the temperature of the electronic components themselves and the ambient temperature to rise, which will affect the normal operation of the electronic components and even lead to a decrease in performance and a shortened life. Therefore, the industry usually configures a heat sink on the electronic components to dissipate heat. The heat sinks used in the industry are often composed of a base and several flat heat sinks erec...

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Problems solved by technology

[0003] However, the bottom plate and cooling fins of the existing radiators are all rigid structures, and their shapes cannot be changed according to the needs of the installation space, and the space adaptability is poor.

And because of the high mobility of the portable electronic device, its shell is usually subjected to the impact of various external forces, and the impact of the external force is directly transmitted to the electronic component through the rigid heat sink, which is easy to cause damage to the electronic component

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