Electronic device and cooling device and cooling fins thereof

A technology of heat sinks and heat sinks, applied in circuits, electrical components, heat exchange equipment, etc., can solve the problems of poor space adaptability, changing shape, damage to electronic components, etc., and achieve the effect of good space adaptability

A technology of heat sinks and heat sinks, applied in circuits, electrical components, heat exchange equipment, etc., can solve the problems of poor space adaptability, changing shape, damage to electronic components, etc., and achieve the effect of good space adaptability

CN101762200AInactive Publication Date: 2010-06-30FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Electronic device and cooling device and cooling fins thereof
  • Electronic device and cooling device and cooling fins thereof
  • Electronic device and cooling device and cooling fins thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0017] Such as figure 1 Shown is the first embodiment of the heat sink 10 of the present invention. The heat sink 10 is made of a metal with good thermal conductivity, such as copper, aluminum, etc., and it includes a first heat conduction plate 11 and a second heat conduction plate 12 arranged in parallel with each other, and is arranged between the first heat conduction plate 11 and the second heat conduction plate. Several cooling fins 13 between the two heat conducting plates 12 .

[0018] The first heat conduction plate 11 and the second heat conduction plate 12 are approximately rectangular plates respectively, and the first heat conduction plate 11 and the second heat conduction plate 12 are parallel to each other. Wherein, the lower surface of the first heat conducting plate 11 is in contact with an electronic component 22 (s...

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Abstract

The invention relates to an electronic device and a cooling device and cooling fins thereof. The cooling device comprises two heat-conducting plates and a plurality of cooling fins arranged between the two heat-conducting plates, wherein the two heat-conducting plates of the cooling device are separately connected with the shell of the electronic device and an electronic element arranged in the shell; and each cooling fin is prepared by bending a piece of flaky material and comprises two flat connection parts which are separately connected with the two heat-conducting plates and at least one bending part which is connected between the two connection parts, the bending part between the two connection parts has elastic stretching and shrinking function, the shape of the cooling fins can be changed according to demands of different installment spaces so that the cooling device is applicable to the demands of different installment spaces and has better spatial adaptability.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device and a heat dissipation fin for heat dissipation of electronic components of an electronic device. Background technique [0002] With the rapid development of the electronic information industry, portable electronic devices such as notebook computers, personal digital assistants, and multimedia mobile phones are also rapidly developing in the direction of high performance and multi-function. If the heat is not removed in time, it will cause the temperature of the electronic components themselves and the ambient temperature to rise, which will affect the normal operation of the electronic components and even lead to a decrease in performance and a shortened life. Therefore, the industry usually configures a heat sink on the electronic components to dissipate heat. The heat sinks used in the industry are often composed of a base and several flat heat sinks erec...

Claims

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Application Information

Patent Timeline
30 Jun 2010
Publication
CN101762200A
IPC
F28F3/00; H05K7/20
CPC
F28F2255/02; H01L23/433; F28F3/02; H01L2924/0002; Y10T428/30; Y10T428/24802; H01L2924/00
Inventors
朱习剑; 林然