Air-cooled heat dissipation structure of high-power converter device

Abstract

The invention relates to an air-cooled heat dissipation structure of a high-power converter device. In the high-power converter device, the inner space of a cavity can be partitioned into a first cavity and a second cavity by a vertical clapboard; the top parts of the first cavity and the second cavity are respectively provided with an air outlet, and the bottoms thereof are respectively provided with an air inlet, so as to form a first heat-dissipation air duct and a second heat-dissipation air duct; a power-electronic power device and a power-electronic control pat are arranged in the first heat-dissipation air duct; an auxiliary transformer, a line-side inductance, a converter-side inductance, an AC filter capacitor, a DC-side resistor and a damping resistor are sequentially distributed along the air flow direction of the second air duct; and the fist duct and the second duct are respectively provided with a fan. In the invention, various passive elements and the power-electronic power device are coordinated and unified for heat dissipation, thereby decreasing the number of the fans and reducing the volume of a heat dissipation device.

Description

technical field [0001] The invention relates to an air-cooling heat dissipation structure of a high-power converter, in particular to an air-cooling heat dissipation structure of an isolated high-power converter device. The invention is mainly used for the air-cooled heat dissipation structure of a high-power converter with many passive components, and belongs to the technical field of power electronic device manufacturing. Background technique [0002] In the industrial field, there are many heat sources in high-power power electronic devices, and these heat sources mainly come from active and passive heating elements. Active heating elements mainly refer to power electronic devices, such as thyristors, IGBTs, GTOs, and IGCTs; passive heating elements mainly include reactors, resistors, transformers, etc. All these heating elements will increase the temperature of the device, resulting in poor performance and reduced life of the components inside the device. With the deve...

AI Technical Summary

Problems solved by technology

For high-power converter devices, relying solely on this cross-flow fan cooling device obviously cannot meet the requirements

The Chinese patent number is 200410073407.3, the patent titled "A high-efficiency, low-noise radiator and improved design of common radiators", which discloses a new type of air-cooled radiator, which can increase the utilization efficiency of air volume and improve the cooling effect , but it does not fundamentally solve the problem of temperature gradient in simple lateral cooling

The Chinese patent number is 200820054320.5, and the patent titled "A Heat Dissipation Device for a Flow Converter" discloses a heat dissipation structure that reduces the temperature gradient between the air inlet and the air outlet of the power module to a certain extent, but does not consider Coordination relationship between power module heat dissipation air duct and other air ducts

In addition, the Chinese Patent No. 200820054322.4, entitled "A Cooling Structure for a Reactor of a Converter Device", discloses a structure that coordinates and unifies the cooling of reactors and power electronic power devices, but it is not suitable for multiple Devices with passive heating elements

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