Low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation

A multi-layer circuit and high-efficiency technology, applied in lamination, lamination devices, chemical instruments and methods, etc., can solve problems such as low production efficiency, high cost, and interlayer misalignment, so as to improve production efficiency and improve interlayer Misalignment, the effect of reducing production costs

Inactive Publication Date: 2010-07-14
深圳玛斯兰电路科技实业发展有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problems of interlayer misalignment, high cost and low p

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] Material selection: PP for the riveting layer requires the use of short G / T PP, and the gel time is 110±10 seconds.

[0008] Inner layer: The core board is punched with an OPE machine.

[0009] Walkthrough:

[0010] A: PP uses the OPE PP punching machine to punch out the corresponding positioning holes, and the punching diameter is 4.5mm.

[0011] B: First use 4 slot holes to position and melt, and then punch 6 rivets for riveting.

[0012] Platen program: (pressure unit: PSI, temperature unit: ℃)

[0013] Temperature / Time: 140 / 5 140 / 15 160 / 10 160 / 11 180 / 14 210 / 11 210 / 34 140 / 20

[0014] Pressure / Time: 100 / 5 100 / 15 250 / 10 280 / 11 280 / 14 280 / 11 280 / 34 200 / 20.

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PUM

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Abstract

The invention discloses a low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation, belonging to the technical field of multi-layer circuit board manufacturing, in particular to a low-cost method for controlling multi-layer circuit board platen manufacturing layer deviation. The method can solve the phenomena of dropping and the like before hot melting position stitching because a well-known punching machine can not simultaneously position, chooses improper hot melting positioning or has personal operation problems due to low precision and hot melting and riveting for walkthrough during punching one by one. The invention adopts an OPE machine to punch by an internal layer of core veneers, and walkthrough simultaneously adopts hot melting and riveting to stake for complementing so as to obtain ideal positioning effect. The method not only can improve production efficiency and low production cost but also can solve the problem of interlayer dislocation.

Description

technical field [0001] The invention belongs to the technical field of multilayer circuit board production, in particular to a low-cost and high-efficiency method for controlling the layer deviation of a multilayer circuit board press plate. Background technique [0002] In the production of multi-layer circuit boards, there are many PP sheets sandwiched between two core boards. During the lamination process, the PP resin is heated to a certain extent and the fluidity is relatively large. When the resin flows, it is easy to pull the core board to make the core board slide. This will cause misalignment between layers, especially when the thickness of the core board is below 5mil (without copper), the partial scrap rate of the production of such structural boards can reach 5%-10%, and the cost is relatively high. [0003] At present, the known manufacturing method of multi-layer circuit board pressure plate is that the riveting layer adopts light plate and PP structure, punche...

Claims

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Application Information

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IPC IPC(8): H05K3/00B32B37/06B32B37/10
Inventor 姜勇
Owner 深圳玛斯兰电路科技实业发展有限公司
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