Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation

A multi-layer circuit and high-efficiency technology, applied in lamination, lamination devices, chemical instruments and methods, etc., can solve problems such as low production efficiency, high cost, and interlayer misalignment, so as to improve production efficiency and improve interlayer Misalignment, the effect of reducing production costs

Inactive Publication Date: 2010-07-14
深圳玛斯兰电路科技实业发展有限公司
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problems of interlayer misalignment, high cost and low production efficiency in the production process of multilayer circuit board pressing board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] Material selection: PP for the riveting layer requires the use of short G / T PP, and the gel time is 110±10 seconds.

[0008] Inner layer: The core board is punched with an OPE machine.

[0009] Walkthrough:

[0010] A: PP uses the OPE PP punching machine to punch out the corresponding positioning holes, and the punching diameter is 4.5mm.

[0011] B: First use 4 slot holes to position and melt, and then punch 6 rivets for riveting.

[0012] Platen program: (pressure unit: PSI, temperature unit: ℃)

[0013] Temperature / Time: 140 / 5 140 / 15 160 / 10 160 / 11 180 / 14 210 / 11 210 / 34 140 / 20

[0014] Pressure / Time: 100 / 5 100 / 15 250 / 10 280 / 11 280 / 14 280 / 11 280 / 34 200 / 20.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation, belonging to the technical field of multi-layer circuit board manufacturing, in particular to a low-cost method for controlling multi-layer circuit board platen manufacturing layer deviation. The method can solve the phenomena of dropping and the like before hot melting position stitching because a well-known punching machine can not simultaneously position, chooses improper hot melting positioning or has personal operation problems due to low precision and hot melting and riveting for walkthrough during punching one by one. The invention adopts an OPE machine to punch by an internal layer of core veneers, and walkthrough simultaneously adopts hot melting and riveting to stake for complementing so as to obtain ideal positioning effect. The method not only can improve production efficiency and low production cost but also can solve the problem of interlayer dislocation.

Description

technical field [0001] The invention belongs to the technical field of multilayer circuit board production, in particular to a low-cost and high-efficiency method for controlling the layer deviation of a multilayer circuit board press plate. Background technique [0002] In the production of multi-layer circuit boards, there are many PP sheets sandwiched between two core boards. During the lamination process, the PP resin is heated to a certain extent and the fluidity is relatively large. When the resin flows, it is easy to pull the core board to make the core board slide. This will cause misalignment between layers, especially when the thickness of the core board is below 5mil (without copper), the partial scrap rate of the production of such structural boards can reach 5%-10%, and the cost is relatively high. [0003] At present, the known manufacturing method of multi-layer circuit board pressure plate is that the riveting layer adopts light plate and PP structure, punche...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00B32B37/06B32B37/10
Inventor 姜勇
Owner 深圳玛斯兰电路科技实业发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com