A multi-layer circuit board lamination pre-positioning and pressing integrated device comprises a
processing table, a mounting frame, a feeding
assembly, a discharging
assembly, a bearing
assembly, a detection assembly and a pressing assembly, the mounting frame stands on the
processing table, the feeding assembly and the discharging assembly are both arranged on the
processing table and the mounting frame, and the bearing assembly is arranged on the processing table. The bearing assembly is arranged on the
machining table and located on one side of the feeding assembly and the discharging assembly. The detection assembly and the pressing assembly are both arranged on the mounting frame and located above the bearing assembly. The bearing assembly comprises a bearing frame, a plurality of lamination pre-positioning jigs and a driving motor. According to the utility model, through designing the multi-
station bearing assembly capable of flexibly rotating, lamination pre-positioning and press-fit processing can be rapidly, reliably and synchronously carried out in the press-fit processing process of the multilayer circuit board, so that the processing efficiency can be greatly improved, and the problem of inter-layer deviation of the circuit board in the transfer process can be effectively improved; the utility model has the advantages of strong practicability and strong popularization significance.