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Reactive carboxylate compound, curable resin composition using the reactive carboxylate compound, and use thereof

A technology of curing resins and compounds, applied in photosensitive materials for opto-mechanical equipment, photo-engraving processes for pattern surfaces, instruments, etc., can solve the problem of unbalanced, undisclosed hydroxyl and epoxy groups. and other problems, to achieve the effects of good developability, excellent resin physical properties, and high dispersibility

Active Publication Date: 2015-11-25
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, Patent Document 4 does not disclose content related to the balance of the amount of hydroxyl groups and epoxy groups in the epoxy resin, and in the disclosed method, the appropriate balance in the present invention cannot be obtained.

Method used

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  • Reactive carboxylate compound, curable resin composition using the reactive carboxylate compound, and use thereof
  • Reactive carboxylate compound, curable resin composition using the reactive carboxylate compound, and use thereof
  • Reactive carboxylate compound, curable resin composition using the reactive carboxylate compound, and use thereof

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Embodiment

[0193] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples. In addition, unless otherwise stated in the examples, "parts" means "parts by weight".

[0194] The softening point and the epoxy equivalent were measured under the following conditions.

[0195] 1) Epoxy equivalent: measured by a method based on JISK-7236:2001.

[0196] 2) Hydroxyl equivalent: It is based on the epoxy equivalent of the corresponding epoxy resin, and according to the reaction of the epoxy group in the epoxy resin with an equivalent amount of acetic acid, after the epoxy group is ring-opened, it is based on JISK0070: 1992 Method to measure the obtained hydroxyl equivalent, and calculated.

[0197] 3) Softening point: measured by the method based on JISK-7234:1986.

[0198] 4) The measurement conditions of GPC are as follows.

[0199] Model: TOSOHHLC-8220GPC

[0200] Column: SuperHZM-N

[0201] Eluent: T...

Synthetic example 1

[0204] Synthesis Example 1: Synthesis of Epoxy Resin

[0205] Implement nitrogen purging in the flask that stirrer, reflux cooling pipe, stirring device are housed, drop into 576g phenol-biphenyl novolac type epoxy resin simultaneously ., a softening point of 70°C, a compound represented by formula (7), n≒3) as the epoxy resin of the above formula (8), the phenol-biphenyl novolac resin of the amount recorded in Table 1 (manufactured by Nippon Kayaku Co., Ltd. The KAYAHARDGPH65 hydroxyl equivalent of 197g / eq., the compound represented by the above formula (5), n≒2) is used as a phenol aralkyl resin, and then the methyl isobutyl ketone (MIBK) that makes the solid content reach 60 parts by weight is added as a solvent . After uniformly dissolving at 70°C, 0.5 g of triphenylphosphine was added, followed by stirring at 100°C for 20 hours. After the reaction is completed, oxygen purging is carried out to oxidize triphenylphosphine to obtain epoxy resin (a) resin solution.

[0206...

Synthetic example NC-300

[0209] Synthesis example NC-3000HGPH-65 (molar ratio) WPEOHVspα

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Abstract

Disclosed is a resin composition which is cured by active energy ray such as ultraviolet light and enables to obtain a tough coating film or a molding material. Specifically disclosed is a reactive compound derived from a phenol aralkyl-type epoxy resin having a specific structure with an excellent balance between hydroxy group and epoxy group. A tough cured product can be obtained from a curable resin composition using such a reactive compound. In addition, the reactive compound exhibits good pigment dispersibility.

Description

technical field [0001] The present invention relates to a reactive epoxy carboxylate compound (A) and a reactive polycarboxylic acid compound (B) as its acid modified product. The reactive epoxy carboxylate compound (A) is made of acrylic acid or the like. A representative compound (b) having more than one polymerizable ethylenically unsaturated group and more than one carboxyl group in the molecule reacts with a phenol aralkyl type epoxy resin (a), wherein the phenol aralkyl type The hydroxyl group, epoxy group, and softening point of the epoxy resin (a) are excellent in balance. The reactive epoxy carboxylate compound (A) and the reactive polycarboxylic acid compound (B) have good pigment dispersibility, and a tough cured product can be obtained from the resin composition containing them, and the cured product is suitable for Materials for film formation, solder resist, plating resist, color photoresist, color filter resist, black matrix and other resists and optical wavegu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/14C08F290/02G03F7/004G03F7/027
CPCC08G59/063C08G59/1438G03F7/032G03F7/0388
Inventor 栗桥透山本和义中西政隆
Owner NIPPON KAYAKU CO LTD
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