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Reactive polyester compound, active energy ray-curable resin composition using same

A technology of active energy rays and curable resins, which is applied in the field of reactive polyester compounds and can solve the problems of low heat resistance, poor solubility and sensitivity, unsatisfactory compounds, etc., and achieve excellent resins Effects of physical properties and good developability

Active Publication Date: 2019-08-06
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in the case of using this binder resin, the heat resistance is still low, whereby a decrease in film thickness is observed
In addition, the balance between solubility and sensitivity is poor, so the following problems may occur: the developer solution permeates into the exposed part while dissolving the unexposed part, protrusions, unevenness, etc. Poor, as the compound has not yet reached a satisfactory level

Method used

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  • Reactive polyester compound, active energy ray-curable resin composition using same
  • Reactive polyester compound, active energy ray-curable resin composition using same
  • Reactive polyester compound, active energy ray-curable resin composition using same

Examples

Experimental program
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Embodiment

[0123] Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples. In addition, in an Example, unless otherwise indicated, "part" means a weight part, and "%" means a weight%.

[0124] The epoxy equivalent, softening point, acid value and molecular weight were measured under the following conditions.

[0125] 1) Epoxy equivalent: according to the method of JIS K 7236:2001

[0126] 2) Softening point: According to the method of JIS K 7234:1986

[0127] 3) Acid value: According to the method of JIS K 0070:1992

[0128] 4) Molecular weight: analyzed by GPC under the following conditions

[0129] Model: TOSOH HLC-8220GPC

[0130] Column: TSKGEL Super HZM-N

[0131] Eluent: THF (tetrahydrofuran); 0.35ml per minute, 40°C

[0132] Detector: Differential refractometer

[0133] Molecular weight standard: polystyrene

Synthetic example 1

[0134] Synthetic example 1 epoxy resin (a) (R in general formula (1) 1 Synthesis of compounds with all hydrogen atoms)

[0135] According to the description in Example 1 of Patent Document 4, the following synthesis was carried out.

[0136] The flask equipped with a thermometer, a condenser, and a stirrer was purged with nitrogen, and at the same time, 256 g of N-phenylphenolphthalein (PPPBP manufactured by SABIC, with a purity of more than 99%), 842 g of epichlorohydrin, and 180 g of methanol were added as phenolic compounds. The temperature was raised to 75°C. When the internal temperature exceeded 65° C., 21 g of flaky sodium hydroxide was added in portions over 90 minutes, and the reaction was further performed at 70° C. for 1 hour. After the reaction, wash twice with 300 g of water to remove the generated salts, and then remove excess epichlorohydrin and the like while stirring under reduced pressure (~70°C, -0.08MPa~-0.09MPa) for 3 hours. Distilled off. To the resid...

Embodiment 1

[0137] Embodiment 1: the synthesis of reactive polyester compound (A-1)

[0138] In a 2L flask equipped with a stirring device and a reflux tube, the epoxy resin (N-phenylphenolphthalein type epoxy resin) synthesized in Synthesis Example 1 was added as the epoxy resin (a) having two or more epoxy groups in the molecule. Resin, epoxy equivalent: 266g / equivalent) 266g, propylene glycol monomethyl ether monoacetate as the solvent for reaction make solid content be 70%, drop in as the monobasic carboxylic acid compound ( b) 72.1 g of acrylic acid (abbreviated as AA, Mw=72), 1.01 g of triphenylphosphine as a catalyst, and 0.17 g of 2-methylhydroquinone as a polymerization inhibitor are reacted at a temperature of 98° C. The acid value became 1.0 mg·KOH / g or less to obtain a diol compound (theoretical molecular weight: 649.69).

[0139] Next, propylene glycol monomethyl ether monoacetate as a solvent was added to the glycol compound solution thus obtained so that the solid content ...

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Abstract

The present invention provides a reactive polyester compound derived from an N-phenylphenolphthalein epoxy resin having a specific structure and exhibiting good developability, heat resistance, and pigment dispersibility. In addition, the present invention provides a curable resin composition containing the above-mentioned reactive polyester compound that can be cured by active energy rays such as ultraviolet rays to obtain a tough coating or molding material.

Description

technical field [0001] The present invention relates to the combination of N-phenylphenolphthalein type epoxy resin (a) having excellent balance of hydroxyl group, epoxy group and softening point with one or more polymerizable ethylenically unsaturated groups represented by acrylic acid etc. in the molecule A reactive polyester compound (A) obtained by polymerizing a compound (b) having at least one carboxyl group and one or more carboxyl groups, and a saturated or unsaturated polybasic acid anhydride (c) having at least two acid anhydride structures in one molecule. The present invention also relates to a reactive polyester compound (A') obtained by reacting a reactive polyester compound (A) with a saturated or unsaturated dibasic acid anhydride (d). [0002] These reactive polyesters have good dispersibility in pigments. In addition, resin compositions suitable for coating film formation, solder resists, plating resists, color photoresists, filters, etc. can be obtained from...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/17C08F290/14C08G59/06G02B5/20G03F7/004G03F7/027
CPCC08F290/14C08G59/06G02B5/20G03F7/004G03F7/027
Inventor 山本和义土方大地
Owner NIPPON KAYAKU CO LTD
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