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Reactive epoxy carboxylate compound, resin composition containing the compound, and cured product of the resin composition

A technology of epoxy carboxylate and resin composition, which is applied in the photoplate making process of the pattern surface, photosensitive materials used in optical mechanical equipment, instruments, etc., can solve the problem of false agglutination of dispersion liquid, poor stability, Unknown problems such as acid-modified epoxy acrylate compounds, etc., to achieve high temperature and high humidity and thermal shock resistance, good storage stability, and excellent resin physical properties

Active Publication Date: 2018-09-04
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its rigid structure and good affinity interaction with pigments lead to false aggregation of its dispersion liquid when forming pigment dispersions, and there is a problem of so-called poor stability
[0007] The epoxy resin described in Patent Document 4 is unknown acid-modified epoxy acrylate compound of the epoxy resin

Method used

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  • Reactive epoxy carboxylate compound, resin composition containing the compound, and cured product of the resin composition
  • Reactive epoxy carboxylate compound, resin composition containing the compound, and cured product of the resin composition
  • Reactive epoxy carboxylate compound, resin composition containing the compound, and cured product of the resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0126] Add 316 parts of phenol and 158 parts of resorcinol to a flask with a thermometer, a cooling tube, and a stirrer, and after raising the temperature to 100°C, add 4,4'-bischloromethylbiphenyl 201 in batches over 2 hours Parts were reacted at the same temperature for another 5 hours. Thereafter, the temperature was raised to 160°C to react all the 4,4'-bischloromethylbiphenyl groups. During this time, generated HCl was distilled off with a basic separator. After completion of the reaction, 266 parts of phenol resins (P-1) were obtained by distilling off unreacted phenol and unreacted resorcinol at 180° C. under reduced pressure using a rotary evaporator. The obtained phenol resin (P-1) had a hydroxyl equivalent of 137 g / eq., a softening point of 94° C., an ICI viscosity of 470 mPa·s, and a divalent phenol introduction ratio of 64%.

Synthetic example 2

[0128] Add 266 parts of phenol resin obtained in Synthesis Example 1, 719 parts of epichlorohydrin, 72 parts of methanol and 21 parts of water to a flask equipped with a stirrer, a reflux cooling tube, and a stirring device while performing nitrogen purge, and heat up to 75°C . Next, after adding 83 parts of flake-shaped sodium hydroxide in batches over 90 minutes, the reaction was further performed at 75° C. for 75 minutes. After completion of the reaction, water washing was performed, and solvents such as excess epichlorohydrin were distilled off from the organic layer under reduced pressure at 140° C. using a rotary evaporator. To the residue, 750 parts of methyl isobutyl ketone was added and dissolved, and the temperature was raised to 75°C. After adding 52 parts of 30% sodium hydroxide aqueous solution with stirring, and reacting for 1 hour, the organic layer was washed with water until the washing water became neutral, and the obtained organic layer was removed from the...

Synthetic example 3

[0130] Add 316 parts of phenol and 126 parts of resorcinol to a flask with a thermometer, a cooling tube, and a stirrer, and after raising the temperature to 100°C, add 201 parts of 4,4'-bischloromethylbiphenyl in batches over 2 hours The base was reacted at the same temperature for another 5 hours. Thereafter, the temperature was raised to 160°C to react all the 4,4'-bischloromethylbiphenyl groups. During this time, generated HCl was distilled off with a basic separator. After completion of the reaction, 194 parts of phenol resins (P-2) were obtained by distilling off unreacted phenol and unreacted resorcinol at 180° C. under reduced pressure using a rotary evaporator. The obtained phenol resin (P-2) had a hydroxyl equivalent of 141 g / eq., a softening point of 89° C., an ICI viscosity of 446 mPa·s, and a divalent phenol introduction ratio of 51%.

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Abstract

The purpose of invention is to provide an excellent resin compound, the resin compound is hardened by the active energy ray such as ultraviolet ray and the like, the light sensitivity is good, the developing capability of the resin comound is good, the obtained hardener comprises sufficient hardenability, flexibility, obdurability, difficult-flammability and pigment dispersibility. The solution is to provide: a reactive epoxy carboxylate compound (A) formed by the reaction of a epoxy resin (a) shown as the general formula (1), polymerizable ethylenically unsaturated group and carboxyl group compound (b) in a molecule, and a hydroxy and carboxyl-containing compound (c) in a molecule as needed; and a reactive polycarboxylic acid compound (B) is formed by the reaction of the reactive epoxy carboxylate compound (A) and polybasic acid anhydride (d). The invention further provides a resin composition comprising the reactive epoxy carboxylate compound (A) and / or reactive polycarboxylic acid compound (B).

Description

technical field [0001] The present invention relates to a reactive epoxy carboxylate compound (A), a reactive polycarboxylic acid compound (B) that is an acid-modified product of the compound (A), a resin composition containing the compounds, and the resin combination A cured product, wherein the reactive epoxy carboxylate compound (A) is an epoxy resin (a) having a polycyclic hydrocarbon group, a compound having a polymerizable ethylenically unsaturated group and a carboxyl group in one molecule It can be obtained by reacting (b) and, if necessary, a compound (c) having a hydroxyl group and a carboxyl group in one molecule. These reactive epoxy carboxylate compounds (A) and reactive polycarboxylic acid compounds (B) have good affinity for pigments, and tough cured products can be obtained from resin compositions containing these compounds. Background technique [0002] In response to the miniaturization and weight reduction of mobile devices and the improvement of communic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/17C08G59/14G03F7/004G03F7/027
Inventor 山本和义小渊香津美
Owner NIPPON KAYAKU CO LTD
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