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Epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing same, and cured product thereof

An active energy ray and epoxy carboxylate technology, applied in the field of reactive epoxy carboxylate compounds and reactive polycarboxylic acid compounds, can solve the problems of pigment dispersibility, poor sensitivity and developability, and achieve good developability, Excellent resin properties and good storage stability

Active Publication Date: 2017-05-17
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this resin is poor in pigment dispersibility, sensitivity, and developability

Method used

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  • Epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing same, and cured product thereof
  • Epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing same, and cured product thereof
  • Epoxy carboxylate compound, derivative thereof, active energy ray-curable resin composition containing same, and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0151] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples. In addition, in an Example, unless otherwise indicated, a part shows a mass part.

[0152] The softening point, epoxy equivalent, and acid value were measured on the following conditions.

[0153] 1) Epoxy equivalent: Measured by a method based on JIS K7236:2001.

[0154] 2) Softening point: Measured by a method based on JIS K7234:1986.

[0155] 3) Acid value: Measured by a method based on JIS K0070:1992.

[0156] 4) The measurement conditions of GPC are as follows.

[0157] Model: TOSOH HLC-8220GPC

[0158] Column: Super HZM-N

[0159] Eluent: THF (tetrahydrofuran); 0.35ml / min, 40°C

[0160] Detector: RI (differential refractometer)

[0161] Molecular weight standard: polystyrene

Synthetic example 1

[0162] Synthesis Example 1: Synthesis of Epoxy Resin

Synthetic example 1-1

[0164] Epoxy resin (X) (XD-1000 manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 254g / eq., average functional group number 2.5 , Mw / Mn value is 1.95) 187 parts, phenolic resin (Y) (Nippon Oil Corporation, DPP-6095L, hydroxyl equivalent 178g / eq., average functional group number 2.2) 13 parts, toluene 50 parts, tetramethyl 0.2 parts of ammonium chloride were reacted at 120° C. for 4 hours. After completion of the reaction, 300 parts of toluene was added, washed with water, and the obtained solution was distilled off at 180° C. under reduced pressure using a rotary evaporator to remove the solvent and the like to obtain 198 parts of the target epoxy resin (EP1). The epoxy equivalent of the obtained epoxy resin was 290 g / eq., the softening point was 92 degreeC, and the melt viscosity (200 degreeC) was 0.10 Pa*s. In addition, the value of Mw / Mn was 2.1.

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Abstract

The present invention provides a novel epoxy carboxylate compound, a derivative thereof, an active energy ray-curable resin composition containing the same, and a cured product thereof. An object of the present invention is to provide an active energy ray-curable resin composition for providing a cured film excellent in curability, flexibility, toughness, and electrical reliability. An active energy ray-curable resin composition containing a reactive epoxy carboxylate compound (A) or a reactive epoxy carboxylate compound (A) obtained by reacting a polybasic acid anhydride (c) Polycarboxylic acid compound (B), the feature of described reactive epoxy carboxylate compound (A) is, by making compound (b) and a compound (b) that have polymerizable ethylenically unsaturated group and carboxyl group simultaneously in a molecule A carboxylic acid compound (c) having both hydroxyl and carboxyl groups in the molecule reacts with an epoxy resin (a), and the epoxy resin (a) is obtained by using glycidyl phenyl ether-octahydro-bridged methylene indene The epoxy resin (X) as a repeating structure is obtained by reacting the phenol-octahydroindene as a repeating structure phenolic resin (Y), and 2<Mw / Mn<20.

Description

technical field [0001] The present invention relates to a reaction obtained by reacting a carboxylic acid compound (b) having both a polymerizable ethylenically unsaturated group and a carboxyl group in one molecule with an epoxy resin (a) containing a polycyclic hydrocarbon group having a specific structure. A reactive epoxy carboxylate compound (A), a reactive polyvalent carboxylic acid compound (B) which is an acid-modified product thereof, an active energy ray-curable resin composition containing them, and a cured product thereof. Background technique [0002] In order to realize the miniaturization and weight reduction of portable devices and the improvement of communication speed, the printed circuit board is required to have high precision and high density, and accordingly, the demand for the solder resist of the circuit itself that covers the circuit board is also increasing. The above-mentioned heat resistance and thermal stability are required, and high reliability...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/17C08G59/42C08G59/20C08F290/14G03F7/004G03F7/027
CPCC08G59/621C08J7/04C08L63/00
Inventor 小木聪中西政隆堀口尚文山本和义小渊香津美
Owner NIPPON KAYAKU CO LTD
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