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Method of brazing heat sink

A technology for heat dissipation and brazing, which is applied in the field of brazing heat dissipation and can solve problems such as increased pressure loss

Active Publication Date: 2011-12-21
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the coolant flows from the pipe 130 to the passage 116 and when it flows from the passage 116 to the pipe 130, the flow direction of the coolant changes sharply, resulting in an increase in pressure loss.

Method used

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  • Method of brazing heat sink

Examples

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Embodiment Construction

[0027] A method for brazing a heat sink according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings. As an example, the description of this embodiment of the invention focuses on a method of brazing a heat sink used in a power module. The power module supplies electricity to the motors that drive the car. The application of the present invention is not limited to heat sinks used in automotive power modules, but can also be applied to any heat sink used to cool heat-generating components.

[0028] figure 2 is a sectional view showing the overall structure of the heat sink 12 including the heat sink 10 according to this embodiment of the present invention. The heat sink 12 has a heat sink 10 and an insulating substrate 16 . A semiconductor chip 14 is mounted on the top side of an insulating substrate 16 . The heat sink 10 is provided on the bottom side of the insulating substrate 16 through a stress relax...

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PUM

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Abstract

The invention relates to a method of brazing a heat sink, the method comprising: fitting at least a portion of a base plate (32) between protruding opposite ends of a top plate (28); securing a clamp (50) to the top plate (28) so that the top plate (28) that prevents thermal expansion extends outward in the width direction of the top plate (28); The side (32a) of the bottom plate (32) of the side (28a).

Description

technical field [0001] The invention relates to a method for brazing heat sinks. Background technique [0002] Conventionally, an insulated gate bipolar transistor (IGBT) semiconductor power module uses a heat sink that effectively dissipates heat generated by a semiconductor chip to maintain the semiconductor chip below a predetermined temperature. [0003] refer to figure 1 Describe the general structure of a typical heat sink. The heat sink 110 is formed of a lightweight material with suitable thermal conductivity, such as aluminum. The heat sink 110 includes a top plate 114 and a bottom plate 118 . The top plate 114 is thermally connected to the heating element 112 . The top plate 114 and the bottom plate 118 form a coolant passage 116 therebetween. The top plate 114 and the bottom plate 118 are bonded together by crimping the top plate 114 and the bottom plate 118 near the middle of the side walls of the heat sink 110 and soldering the crimped portion 120 . [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCB23K1/0012Y10T29/49393
Inventor 大塚健司中岛優富田芳樹
Owner TOYOTA JIDOSHA KK