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Apparatus and method for treating substrate

A technology for substrates and equipment, applied in the field of processing substrates and optical processing modules, which can solve problems such as inability to provide effective scheduling of return manipulators

Active Publication Date: 2010-08-25
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to a typical plant, the chambers and the return robots for performing the respective processes are inefficiently arranged, so that efficient scheduling of the return robots cannot be provided

Method used

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  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate

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Embodiment Construction

[0028] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention can also be embodied in different forms and is not limited to the examples listed here. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0029] The apparatus of the embodiment of the present invention is used to perform a photolithography process of a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of the embodiment of the present invention is used to perform required pre-exposure / post-exposure processes before and after the coating process, development process and immersion lithography process. In the following description, embodiments will be described by taking a wafer as an example as a substrate.

[0030] Figure 1 to Figure 4 is a schematic diagra...

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Abstract

An apparatus and method for treating a substrate are provided. The apparatus includes a load port, an index module, a first buffer module, a coating / developing module, a second buffer module, a pre / post-exposure treatment module, and an interface module, which are sequentially arranged in a direction. The coating / developing module includes a coating module and a developing module, which are arranged in different layers. The pre / post-exposure treatment module includes a pre-treatment module and a post-treatment module, which are disposed at different layers. The pre-treatment module coats a protective layer on the wafer before an exposure process. The post-treatment module performs a wafer cleaning process and a post-exposure bake process after the exposure process. A robot for transferring the wafer is disposed in each of the pre-treatment and post-treatment modules.

Description

[0001] Cross References to Related Applications [0002] This U.S. nonprovisional patent application requires a filing date of January 30, 2009, application number 10-2009-0007629 and a filing date of March 31, 2009, application number 10-2009-0027375 in Korea under 35 U.S.C. §119 The priority of the patent application, the entire content of which is hereby incorporated by reference. Background technique [0003] The present invention relates to an apparatus and method for processing a substrate, and more particularly to an apparatus and method for performing a photolithography process of a wafer. [0004] To manufacture a semiconductor device, various processes are performed, such as a cleaning process, a deposition process, a photolithography process, an etching process, an ion implantation process, and the like. A photography process for forming patterns plays an important role in the high integration of semiconductor devices. [0005] Generally, a system for performing a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/677
CPCG03F7/70341H01L21/67178G03F7/70808G03F7/70991H01L21/67184H01L21/67225H01L21/6715G03F7/7075
Inventor 金东浩崔晋荣高在昇卢亨来
Owner SEMES CO LTD