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Coated conductive powder and conductive adhesive using the same

一种导电性、导电性颗粒的技术，应用在导电粘合剂、导电黏合剂连接、分散在不导电无机材料中的导电材料等方向，能够解决膜剥落、导电性颗粒变形、破坏等问题

Active Publication Date: 2010-09-15
NIPPON CHECMICAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, when kneading and dispersing the conductive particles agglomerated twice with the binder, it is necessary to perform a long-term treatment with a strong shearing force, so that deformation and destruction of the conductive particles and film damage occur. peeling off

Method used

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  • Coated conductive powder and conductive adhesive using the same
  • Coated conductive powder and conductive adhesive using the same
  • Coated conductive powder and conductive adhesive using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～14 and comparative example 1～5

[0109] Insulating inorganic fine particles shown in Table 3, a predetermined amount of conductive particles, and zirconia balls (particle diameter 1 mm) with an apparent volume of 0.3 L were placed in a cylindrical container (can mill) with an inner capacity of 0.7 L and an inner diameter of 0.09 m. Machine) was added to the seal and rotated at 100 rpm. The rotation speed at this time was calculated|required by setting a as 0.71 in the following formula (t). After treating for 60 minutes to uniformly adhere the insulating inorganic fine particles to the conductive particles, the zirconia balls and the obtained coated conductive powder were separated.

[0110] N = a × 42.3 / D · · · ( t )

[0111] N: speed [rpm]

[0112] D: Inner diameter of the container where the ball is seen [m]

[0113] a: constant

[0114] In addition, wh...

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PUM

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Abstract

Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable of forming an electrical connection of high reliability even for an electrode connection in miniaturized electronic devices such as IC chips or circuit boards. Specifically disclosed is a coated conductive powder which is obtained by coating the surfaces of conductive particles with insulating inorganic fine particles. The coated conductive powder is characterized by having a volume resistivity of not more than 1 Om. The coated conductive powder is also characterized in that the insulating inorganic fine particles have a specific gravity of not more than 5.0 g / ml, and the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (insulating inorganic fine particles / conductive particles) is not more than 1 / 100. The coated conductive powder is further characterized in that the insulating inorganic fine particles are adhering to the surfaces of the conductive particles.

Description

technical field [0001] The present invention relates to coated conductive powder and conductive adhesive, and particularly relates to an anisotropic conductive adhesive used for electrically connecting circuit boards, circuit components, and the like to each other. Background technique [0002] When electrically connecting circuit boards or electronic components such as IC chips and circuit boards, anisotropic conductive adhesives in which conductive particles are dispersed can be used, and these adhesives can be placed between opposing electrodes. After heating and pressing to connect the electrodes, electrical connection and fixation are performed by making the electrodes conductive in the direction of pressing. [0003] As the above-mentioned conductive particles, for example, conductive metal particles and conductive plated particles in which the surface of the particles of the core material is formed with a metal film by electroless plating can be used. [0004] Usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00C09J9/02C09J201/00H01B1/22H01R11/01
CPCC09J11/04H05K2201/0224H01R4/04C08K3/0066H05K2201/0221H01B1/22H05K3/323C08K9/02C09J9/02H05K2201/0209C08K3/017Y10T428/2991
Inventor 阿部真二
Owner NIPPON CHECMICAL IND CO LTD
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