Substrate classification method

Abstract

The present invention relates to a substrate classification method. The present invention provides the substrate classification method which can perform classification without efficiency reduction at an occasion when the number of the kinds of the classified substrates is larger than the number of the classification opening and furthermore dose not require the flowing of the substrates from a conveying inlet when a box of a certain classification opening is full. A substrate classification device used for the substrate classification method comprises the following components: a conveying-in side buffer device which temporarily holds the substrates in a box provided at a conveying-in inlet; a conveying device which conveys the substrates held at the conveying-in side buffer device to a certain classification opening one by one; and conveying-out side buffer devices which are respectively provided at each classification opening and temporarily holds the substrates conveyed by the conveying device. Hereon, at least one in the conveying-out side buffer devices is a random access buffer device. In the substrate classification method, while a plurality of substrates are held in the random access buffer, the substrates are conveyed to different conveying-out boxes according to each kind.

Description

technical field [0001] The present invention relates to a substrate sorting method using a substrate sorting device installed in a clean room such as an LCD (liquid crystal) factory or a semiconductor factory. Background technique [0002] Originally, in the case of making a substrate such as an LCD (liquid crystal), after forming a plurality of identical circuit patterns on a large substrate (such as a glass substrate), the substrate is cut and the resulting required circuit substrate is sent to the next stage. A bonding process. [0003] In recent years, as the manufacturing process of the circuit pattern becomes complicated and the circuit scale increases, the occurrence rate of circuit defects tends to increase. If such a circuit board with a defective circuit is sent as it is to the next bonding process, the bonding process is useless. Therefore, in order to minimize the loss, a functional test of each circuit pattern is performed before cutting the substrate. [000...

AI Technical Summary

Problems solved by technology

[0008] In the conventional sorting process as described above, when the number of types of substrates to be sorted is greater than the number of sorting ports, the sorting process needs to be performed in multiple times, resulting in low sorting efficiency.

[0009] In addition, the straight-in buffer device can only take out the substrates stored in the cassette one by one from the bottom, and cannot change the order of the substrates from the cassette at the loading port.

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