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Tin-lithium system lead-free solder

A lead-free solder and solder technology, which is applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problem that solder cannot meet lead-free requirements, and achieve the effect of proper fluidity and improved oxidation resistance.

Active Publication Date: 2012-07-04
好利来(厦门)电路保护科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solder that meets the requirements of this special soldering process is currently only solder in the lead-tin hypoeutectic region, such as 35Sn (Sn35%Pb65%), etc., and this type of solder cannot meet the requirements of lead-free

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1, to manufacture 100 kg of tin-lithium lead-free solder, the raw material formula is: 95 kg of solder alloy and 5 kg of flux, wherein 95 kg of solder alloy consists of tin: 92.625 kg, lithium: 2.185 kg, nickel: 0.095 kg 1. Rare earth: 0.095 kg composition; the raw materials of the formula can be obtained according to the above-mentioned manufacturing method to obtain the tin-lithium lead-free solder of the present invention.

Embodiment 2

[0022] Example 2, to manufacture 100 kg of tin-lithium lead-free solder, the raw material formula is: 100 kg of solder alloy and 0 kg of flux, wherein 100 kg of solder alloy is composed of 99.5 kg of tin and 0.5 kg of lithium; the raw materials of the formula The tin-lithium lead-free solder of the present invention can be prepared according to the above-mentioned manufacturing method.

Embodiment 3

[0023] Example 3, to manufacture 100 kg of tin-lithium lead-free solder, the raw material formula is: 100 kg of solder alloy and 0 kg of flux, wherein 100 kg of solder alloy is composed of 98.5 kg of tin, 1.4 kg of lithium and 0.1 kg of nickel; The raw materials of the formula can be prepared according to the above-mentioned manufacturing method, and the tin-lithium lead-free solder of the present invention can be obtained.

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PUM

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Abstract

The invention discloses a tin-lithium system lead-free solder, which is characterized in that the tin-lithium system lead-free solder comprises 95-100 percent of solder alloy and 0-5 percent of scaling powder by weight percent. The solder alloy comprises the following components by weight percent: 97.5-99.5 percent of tin, 0.5-2.5 percent of lithium, 0-0.1 percent of nickel and 0-0.1 percent of rare earth. The melting point of the tin-lithium system lead-free solder prepared by the formula is proper, the solid-liquid coexistence temperature range is wide, typically about 55-85 DEG C, the generation proportion of the solid-phase substance in the liquid-solid coexistence region is properly increased with the decrease of temperature, the viscosity of the liquid-solid coexistence substance atthe weld cooling stage is properly higher, the mobility is proper, the change of liquid-phase proportion and the solid-phase proportion during solidification is proper and the solidification is gradually realized at a mild and stable speed. Thereby, the tin-lithium system lead-free solder of the invention can satisfy the special requirements on the solder used for special soldering places such asfuse tube soldering and the like.

Description

technical field [0001] The invention relates to a lead-free solder, in particular to a tin-lithium lead-free solder. Background technique [0002] Most of the existing soldering materials are leaded solders. When various electronic products made of leaded solders are discarded or recycled, they will cause lead pollution to the environment and bring great harm to people's health. In order to reduce or even eliminate lead pollution caused by lead solder, my country's Ministry of Information Industry promulgated the "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" as early as 2003, which clearly stipulates that "producers should take measures to gradually reduce and phase out electronic products. Content of lead, cadmium, cadmium, hexavalent chromium, polymeric brominated biphenyl, polymeric brominated biphenyl ethyl ether and other toxic and harmful substances in information products.” Therefore, lead-free solder must be g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 赖文辉
Owner 好利来(厦门)电路保护科技有限公司
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